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74ABT00D,112

NXP Semiconductors

74ABT00D,112 by NXP Semiconductors

NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.997

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,157 parts In-Stock

1+ parts

-

100+ parts

$0.979

1k+ parts

$0.812

10k+ parts

$0.724

4,157

-

$0.979

$0.812

$0.724

DigiKey

USA . 4,157 parts In-Stock

1+ parts

-

100+ parts

-

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$1.220

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-

4,157

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$1.220

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Verical

USA . 2,280 parts In-Stock

1+ parts

-

100+ parts

-

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$1.015

10k+ parts

$0.905

2,280

-

-

$1.015

$0.905

Farnell

UK . 452 parts In-Stock

1+ parts

-

100+ parts

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$0.422

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452

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$0.422

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Distributors (In-Stock)

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Digiode

USA . 3,720 parts In-Stock

1+ parts

$0.391

100+ parts

-

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3,720

$0.391

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Chip Stock

USA . 59,000 parts In-Stock

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59,000

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Vyrian

USA . 5,860 parts In-Stock

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Anansix

USA . 355 parts In-Stock

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355

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Distributors (Availability)

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Corphita

USA . 3,579 parts In-Stock

1+ parts

$0.371

100+ parts

-

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-

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3,579

$0.371

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AZTECH Wire

Italy . 6,327 parts In-Stock

1+ parts

$0.510

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6,327

$0.510

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Native Components

USA . 1,614 parts In-Stock

1+ parts

$14.987

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1,614

$14.987

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Northwest PG Solutions

USA . 3,922 parts In-Stock

1+ parts

$16.486

100+ parts

$14.838

1k+ parts

-

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3,922

$16.486

$14.838

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$24.373

100+ parts

$22.179

1k+ parts

$19.986

10k+ parts

-

2,500

$24.373

$22.179

$19.986

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Continental Prestige Electronics

USA . 4,157 parts In-Stock

1+ parts

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100+ parts

$0.490

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4,157

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$0.490

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UNI Independent Distributors

Spain . 3,812 parts In-Stock

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3,812

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Perfect Parts

USA . 2,745 parts In-Stock

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Supply Digital

USA . 2,303 parts In-Stock

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2,303

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Microchip USA

USA . 376 parts In-Stock

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376

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Speed Components Ltd (Excess)

Israel . 54 parts In-Stock

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Technical Specifications

Logic Gates 74ABT00D,112 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.05 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

3.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74ABT00D,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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