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2N7002BKT,115

NXP Semiconductors

2N7002BKT,115 by NXP Semiconductors

NXP Semiconductors' 2N7002BKT,115 is a N-CHANNEL FET with 0.29A ID and 0.32W power dissipation. Ideal for applications requiring enhancement mode operation, it has a max operating temp of 150°C. Suitable for surface mount configurations, this MOSFET offers reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,996 parts In-Stock

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QIE Inc.

USA . 2,296 parts In-Stock

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Digiode

USA . 1,433 parts In-Stock

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VNN

France . 300 parts In-Stock

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300

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Speed Components Ltd

Israel . 260 parts In-Stock

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260

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Anansix

USA . 160 parts In-Stock

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160

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Semtec, LLC

USA . 140 parts In-Stock

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140

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 458 parts In-Stock

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$1.050

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AZTECH Wire

Italy . 582 parts In-Stock

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$7.912

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Ampacity Inc.

Singapore . 962 parts In-Stock

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$33.050

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Microchip USA

USA . 6,622 parts In-Stock

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Argo Parts USA

USA . 4,166 parts In-Stock

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Corphita

USA . 3,534 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 342 parts In-Stock

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UNI Independent Distributors

Spain . 131 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the 2N7002BKT,115 by NXP Semiconductors. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability. Ideal for a wide range of applications, from consumer electronics to industrial automation, this Enhancement Mode transistor delivers exceptional efficiency and durability. Experience seamless operation and superior functionality with the 2N7002BKT,115, the perfect choice for your next project.

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher electron mobility, making them efficient for various power applications.

Configuration: SINGLE

Single configuration FETs are easy to use and suitable for simple circuit designs.

Surface Mount: YES

Surface mount FETs are convenient for automated assembly processes and save space on the circuit board.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-resistance, and efficient power handling capabilities.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) 2N7002BKT,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.29 A

Maximum Drain Current (ID):

.29 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

2N7002BKT,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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