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NAU8822LYG

Nuvoton Technology

NAU8822LYG by Nuvoton Technology

PCM CODEC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

Median Price

$0.970

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5,000 parts In-Stock

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$0.970

10k+ parts

$0.836

5,000

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$0.970

$0.836

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,098 parts In-Stock

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9,098

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Distributors (Availability)

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QUARKTWIN TECHNOLOGY LTD

USA . 13,213 parts In-Stock

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13,213

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Futuretech Components

Singapore . 709 parts In-Stock

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709

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Perfect Parts

USA . 22 parts In-Stock

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Technical Specifications

Audio Codecs NAU8822LYG attributes and parameters. Explore more Audio Codecs devices from Nuvoton Technology

Specs

Additional Features:

ANALOG SUPPLY VOLTAGE IS 3.3 V

Companding Law:

A/MU-LAW

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Linear Coding:

8-BIT

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

32

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

NAU8822LYG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Nuvoton Technology

Nuvoton Technology Corporation (Nuvoton) was founded to bring innovative semiconductor solutions to the market. Nuvoton was spun-off as a Winbond Electronics affiliate in July 2008 and went public in September 2010 on the Taiwan Stock Exchange (TWSE). Nuvoton focuses on the developments of microcontroller, microprocessor, smart home, cloud security, battery monitoring, component, visual sensing and IoT with security ICs and has strong market share in Industrial, Automotive, Communication, Consumer and Computer markets. Nuvoton owns 6-inch wafer fabs equipped with diversified processing technologies to provide professional wafer foundry services. Nuvoton provides products with a high performance/cost ratio for its customers by leveraging flexible technology, advanced design capability, and integration of digital and analog technologies. Nuvoton values long term relationships with its partners and customers and is dedicated to continuous innovation of its products, processes, and services. Nuvoton has established subsidiaries in the USA, China, Israel, India, Singapore, Korea and Japan to strengthen regional customer support and global management.

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