Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Device Type Used On: DIP42; Housing Material: POLYETHYLENE; No. of Contacts: 42; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
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Chip Carrier IC & Component Sockets 110-43-642-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-43-642-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Shanghai Lunsure Electronic Technology
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
Panjit International
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
1N4148WT
Taitron Components
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
M12883/45-01
Amphenol
Amphenol's M12883/45-01 is a POLYETHERIMIDE chip carrier socket with 8 GOLD contacts for RELAY devices. It is designed as a RELAY SOCKET, suitable for various relay applications due to its high-quality contact finish and durable housing material.
XR2T-2473-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
5663
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC52; Manufacturer Series: 5663; No. of Contacts: 52; Additional Features: PLCC SOCKET, 94V-0;
123-13-322-41-001000
Mill-max Mfg
123-13-322-41-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP22 devices with 22 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
110-87-328-41-001101
Preci-dip Sa
110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.
PY14QN2-Y3
RELAY SOCKET;
7-1437539-0
TE Connectivity
TE Connectivity's 7-1437539-0 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular contact pattern, suitable for applications requiring a dielectric voltage withstand of 1400VAC. The socket has a housing made of polyester and operates within -55 to 105°C temperature range, terminated by soldering with mating pitch of 0.1 inch.
A08-LC-TT
Assmann Wsw Components
A08-LC-TT by Assmann Wsw Components is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and polybutylene terephthalate housing material. It has a solder termination type, bellowed contact style, and can withstand temperatures from -55 to 85°C. Ideal for applications requiring a chip carrier socket with rectangular contact pattern on a 0.1-inch pitch.
3-1571552-2
TE Connectivity's 3-1571552-2 is a Chip Carrier IC Socket with 40 contacts, rated at 3A current. It has a PCB contact row spacing of 15.24mm and uses POLYETHYLENE/POLYESTER housing material. Ideal for DIP40 devices, it operates b/w -55 to 105°C and features solder termination for reliable connections.
1-822473-7
TE Connectivity 1-822473-7 is a PLCC84 IC socket with POLYETHYLENE housing. Featuring 84 contacts, it has an insulation resistance of 1G ohm and dielectric voltage of 830VAC. Ideal for applications requiring a straight mounting style, this socket operates b/w -20°C to 85°C and can handle up to 1A current rating.
8PFA1
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
415-43-236-41-003000
The Mill-max Mfg 415-43-236-41-003000 is a POLYETHYLENE chip carrier IC socket with 36 contacts, TIN termination, and RECTANGLE contact configuration. It is designed for use on SIP36 devices, providing reliable connectivity in electronic applications.
95.03SPA
Finder
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 5;
10140369-201LF
Amphenol Communications Solutions
Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
XR2H-2011-N
IC SOCKET; Manufacturer Series: XR2;
214-44-308-01-670800
214-44-308-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing material and MATTE TIN finish. It is designed for DIP8 devices, featuring 8 contacts in RECTANGLE configuration. Ideal for secure connection of integrated circuits in various electronic applications.
510-93-169-17-101002
510-93-169-17-101002 by Mill-max Mfg is a Chip Carrier IC Socket with 169 contacts, PCB contact row spacing of 2.54mm, and rectangular contact pattern. It is used on PGA169 devices, has a solder termination type, and operates b/w -55°C to 125°C.
224-1286-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 224-1286-00-0602J is a DIP24 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 24 gold-over-nickel contacts for mating and termination, ideal for chip carrier IC applications.
VCF4-1001
IC SOCKET; Termination Type: SOLDER; No. of Contacts: 1; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
818-22-016-10-000101
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
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12,000 In-Stock
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