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M2S090TS-FCSG325

Microsemi

M2S090TS-FCSG325 by Microsemi

Microsemi's M2S090TS-FCSG325 FPGA features 86316 logic cells, 180 inputs/outputs, and operates at a max supply voltage of 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact designs with a grid array package style.

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Overview

Elevate your projects to new heights with the M2S090TS-FCSG325 Field Programmable Gate Array by Microsemi. Boasting 86316 logic cells and a cutting-edge CMOS technology, this FPGA delivers unparalleled performance and versatility. With a compact rectangular package body made of durable plastic/epoxy material, Surface Mount compatibility, and 180 inputs/outputs, this FPGA is designed to meet the demands of a wide range of applications. Trust in Microsemi's reputation for quality and innovation, and unlock limitless possibilities with the M2S090TS-FCSG325. Experience the value, benefits, and advantages this exceptional product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the product.

No. of Logic Cells: 86316

High number of logic cells allows for complex programmability and customization, making this FPGA suitable for a wide range of applications.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage provides flexibility in power options and compatibility with various systems.

Technology Used: CMOS

CMOS technology offers low power consumption and efficient performance, making the FPGA energy-efficient and cost-effective.

No. of Inputs: 180

Ample number of inputs allow for versatility in connecting to different devices and systems, increasing the product's compatibility.

Package Shape: RECTANGULAR

Rectangular shape facilitates easier integration into circuit boards and systems, saving space and simplifying the design process.

Form Of Terminal: BALL

Ball terminals ensure secure and reliable connections, reducing the risk of loose connections and improving overall performance.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent and reliable operation, enhancing the product's reliability and performance.

Power Supplies (V): 1.2

Consistent power supplies contribute to stable performance and reduce the risk of power-related issues, improving the product's reliability.

No. of Terminals: 325

Higher number of terminals allow for more connections and versatility in integration, making this FPGA suitable for complex systems and applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility in programming and customization, making it adaptable to various requirements and applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch package style provides compact design, allowing for efficient space utilization and integration into tight spaces.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage enables energy-efficient operation and reduces power consumption, making the product cost-effective and environmentally friendly.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in demanding environments and applications, making this FPGA suitable for industrial and high-temperature settings.

Pitch Of Terminal: 0.5 mm

Small pitch of terminals allows for compact design and efficient space utilization, making this FPGA suitable for applications where space is limited.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature provides versatility in usage across different environments and ensures reliable performance in various conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Tin, silver, and copper finishing of terminals provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Position Of Terminal: BOTTOM

Bottom position of terminals simplifies PCB layout and assembly, making integration easier and faster.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that this FPGA can withstand moderate exposure to moisture during handling and storage, reducing the risk of damage.

Maximum Seated Height: 1.16 mm

Low maximum seated height allows for thin and compact design, ideal for applications where space is limited and height constraints exist.

Width: 11 mm

Narrow width facilitates space-efficient integration into systems and circuit boards, making this FPGA suitable for compact designs and applications.

No. of Outputs: 180

Ample number of outputs allow for versatile connectivity and signal routing, enhancing the product's capability and flexibility in various applications.

Maximum Time At Peak Reflow Temperature (s): 40

Long maximum time at peak reflow temperature allows for precise reflow soldering and ensures proper connectivity during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature enables reliable and durable soldering, ensuring strong connections and long-term performance.

Length: 13.5 mm

Compact length facilitates space-efficient integration and allows for versatile placement in systems and circuit boards, suitable for designs where space is limited.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S090TS-FCSG325 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi

IC Features

Programmable IC Type:

No. of Logic Cells:

86316

No. of Inputs:

180

No. of Outputs:

180

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Additional Features:

LG-MIN, WD-MIN

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13.5 mm

Width:

11 mm

Maximum Seated Height:

1.16 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M2S090TS-FCSG325 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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