Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00003 Amp;
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Flash Memory RD48F2000L0YUQ0 attributes and parameters. Explore more Flash Memory devices from Micron Technology
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RD48F2000L0YUQ0 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Allegro MicroSystems
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
STM32F407VGT6
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Nexperia
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
Hitano Enterprise
S25FL512SAGBHIC13
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Alternate Memory Width: 1;
AT25SF161B-SSHB-T
Renesas Electronics
AT25SF161B-SSHB-T by Renesas Electronics is a 16Mb NOR Flash Memory with SPI interface, operating at up to 108MHz. It features 100,000 Write/Erase cycles and supports hardware/software write protection. Ideal for industrial applications requiring high-speed data storage in a compact package.
AT25SF041B-SSHD-T
AT25SF041B-SSHD-T by Renesas Electronics is a 4Mx1 NOR flash memory with 108MHz clock frequency, SPI serial bus type. It operates at -40 to 85°C, has 100K write/erase cycles endurance, and is suitable for industrial applications requiring high-speed data storage in compact devices.
AT45DB641E-SHN-B
AT45DB641E-SHN-B by Renesas: 64MX1 organization, 85MHz clock frequency, 67108864-bit memory density. Ideal for industrial applications requiring high-speed synchronous flash memory with a small outline package and operating temperature range of -40 to 85°C.
S25FL256SAGMFI011
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SST39SF010A-70-4C-NHE
Silicon Storage Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Toggle Bit: YES;
SDSDQAB-008G
Western Digital
SDSDQAB-008G by Western Digital is a flash memory chip with 8GX8 organization and 8G word code. It operates b/w -25 to 85 °C, suitable for various applications requiring high memory density like flash cards. The chip features CMOS technology, rectangular shape, and upper terminal position for surface mounting.
MT25QU512ABB1EW9-0SIT
Micron Technology
Micron Technology's MT25QU512ABB1EW9-0SIT is a 512M NOR flash memory with 536870912-bit density. Operating at 166 MHz, it has a supply voltage range of 1.7V to 2V and temperature tolerance from -40°C to 85°C. Ideal for industrial applications requiring high-speed synchronous operation in small outline packages.
S25FL256SAGMFIR01
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
MT25QU128ABA1EW9-0SIT
Micron Technology's MT25QU128ABA1EW9-0SIT is a 128MX1 NOR flash memory with 134217728-bit density. Operating at 166 MHz, it has a supply voltage range of 1.7V to 2V and supports industrial temperature grade applications. With a compact package style and serial interface, it is suitable for various embedded systems requiring high-speed data storage.
IS21ES04G-JCLI-TR
Integrated Silicon Solution
IS21ES04G-JCLI-TR by Integrated Silicon Solution is a synchronous flash memory with 4GX8 organization, 34359738368 bit memory density, and operates at industrial temperature grade. It features a very thin profile grid array package with 153 terminals and is suitable for applications requiring high-speed data storage in industrial environments.
S25FL512SAGMFI011
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
AT25DF081A-SSH-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00001 Amp;
S25FL128SAGMFI000
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 7.5 mm;
S25FL256SAGNFI003
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Boot Block: BOTTOM;
W25Q64JVZEIQ
Winbond Electronics
Winbond Electronics' W25Q64JVZEIQ is a NOR type flash memory with 8Mx8 organization, SPI serial bus, and 133 MHz clock frequency. Ideal for industrial applications, it offers 100000 write/erase cycles endurance and operates at temperatures ranging from -40 to 85 °C.
S29GL128P90FFIR20
S29GL128P90FFIR20 by Infineon Technologies is a 128Mx1 NOR flash memory with 128 sectors, operating at 3.3V. It features an asynchronous mode, 90ns access time, and a max temperature of 85°C. Ideal for industrial applications requiring high-speed data storage in compact devices.
KLMAG1JETD-B0410
Samsung
FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 137438953472 bit;
S25FL256SAGMFIR00
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 268435456 bit;
SST25VF016B-50-4C-QAF
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; JESD-609 Code: e4;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
RD48F3000M0YBB0
FLASH; Temperature Grade: OTHER; No. of Terminals: 105; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Access Time: 96 ns;
RD48F2000W0YUQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
RD48F2000P0XBQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
RD48F3000L0ZBQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 80; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 8M;
RD48F3000L0YBQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
RD48F2000P0ZTQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Page Size (words): 4;
RD48F3000M0YBC0
FLASH; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: FBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
RD48F1000W0YUQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Access Time: 60 ns;
RD48F2200W0YDQ0
FLASH; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Boot Block: BOTTOM/TOP; Power Supplies (V): 1.8;
RD48F2000P0XTQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: TFBGA; Package Shape: RECTANGULAR; Toggle Bit: NO;
RD48F3000L0YUQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Toggle Bit: NO;
RD48F3000L0YCQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;
RD48F2000P0ZBQ0A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
RD48F3000L0ZTQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 80; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
RD48F2000W0YCQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Page Size (words): 4;
RD48F1000W0YCQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
RD48F2000L0YCQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Sector Size (Words): 16K,64K;
RD48F2000P0ZBQ0
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 10 mm;
RD48F3000L0YTQ0
FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
RD48F2000L0YUQ0
Numonyx
FLASH; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;
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