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VSC8552XKS-01

Microchip Technology

VSC8552XKS-01 by Microchip Technology

Microchip Technology's VSC8552XKS-01 is an Ethernet transceiver with 256 terminals in a square grid array package. Operating temperature ranges from 0 to 125°C, making it suitable for telecom applications. With a nominal voltage of 1V and surface mount capability, it offers high performance in network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,422 parts In-Stock

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4,422

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$10.373

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439

$10.373

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Vigor

Singapore . 1,951 parts In-Stock

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$22.580

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$22.580

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Ampacity Inc.

Singapore . 1,026 parts In-Stock

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$154.000

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$154.000

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Marpe Global Electronics

Taiwan . 7,236 parts In-Stock

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7,236

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Continental Prestige Electronics

USA . 6,770 parts In-Stock

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6,770

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QualityLine Systems

Poland . 6,303 parts In-Stock

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6,303

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XL Components Corporation

Australia . 4,764 parts In-Stock

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Argo Parts USA

USA . 3,646 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 250 parts In-Stock

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250

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Perfect Parts

USA . 157 parts In-Stock

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157

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Overview

Experience seamless networking with the VSC8552XKS-01 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability in their network interfaces. Whether you're looking to enhance your data center, telecommunications infrastructure, or industrial applications, this Ethernet transceiver offers unparalleled performance and efficiency. With its advanced features and durable construction, the VSC8552XKS-01 provides exceptional value and benefits to customers seeking a high-quality networking solution. Trust Microchip Technology to elevate your networking experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape provides uniformity and ease of placement within electronic systems.

No. of Terminals: 256

Having a high number of terminals allows for multiple connections and data transfer channels.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient heat dissipation and electrical performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable operation in various temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position provides secure connections and ease of installation.

Maximum Seated Height: 1.8 mm

Low maximum seated height enables compact design and space-saving installation.

Width: 17 mm

Moderate width allows for compatibility with standard electronic layout configurations.

Length: 17 mm

Moderate length offers a balanced form factor for integration into various systems.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections and signal transmission.

Telecom IC Type: ETHERNET TRANSCEIVER

Ethernet transceiver technology enables high-speed data transfer and connectivity for network applications.

Nominal Supply Voltage: 1 V

Low nominal supply voltage for efficient power usage and energy savings.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density mounting and improved signal integrity.

Technical Specifications

Network Interfaces VSC8552XKS-01 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.8 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

VSC8552XKS-01 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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