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TCM811TERCTR

Microchip Technology

TCM811TERCTR by Microchip Technology

TCM811TERCTR by Microchip Technology is a Power Management IC with 3.3V nominal voltage, -40 to 85°C operating temperature range, and 4 terminals in a small outline package. It is ideal for power supply support circuits in industrial applications requiring low profile components.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$0.460

100+ parts

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36

$0.460

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Vyrian

USA . 7,051 parts In-Stock

1+ parts

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7,051

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R&J Components

USA . 5,521 parts In-Stock

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5,521

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SPM Sales

USA . 2,098 parts In-Stock

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2,098

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ACDS - Activité Composants Distribution Service

France . 266 parts In-Stock

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266

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.460

100+ parts

$0.451

1k+ parts

-

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2,000

$0.460

$0.451

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Ampacity Inc.

Singapore . 168 parts In-Stock

1+ parts

$1.500

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168

$1.500

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AZTECH Wire

Italy . 310 parts In-Stock

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$10.570

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310

$10.570

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Kepictronics

USA . 30,000 parts In-Stock

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Lixinc

USA . 17,905 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

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6,000

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GreenTree Electronics

Israel . 3,826 parts In-Stock

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3,826

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Microchip USA

USA . 316 parts In-Stock

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316

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Glotronic Ltd.

UK . 213 parts In-Stock

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213

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RGB Technical Solutions

Ukraine . 111 parts In-Stock

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111

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Overview

Discover the cutting-edge TCM811TERCTR by Microchip Technology, a top-tier manufacturer known for producing high-quality Power Management ICs. This compact yet powerful device offers a wide range of applications, providing customers with reliable and efficient power supply support. With a nominal supply voltage of 3.3V and industrial-grade temperature tolerance, this IC is perfect for various electronic devices. Experience the convenience and performance that only Microchip Technology can deliver with the TCM811TERCTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the IC, making it ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape allows for space-saving placement on a PCB, maximizing board real estate for other components.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in many electronic systems, making this IC compatible with a wide range of applications.

Power Supplies (V): 3.3

This IC provides a 3.3V power supply, suitable for various low-power devices and circuits.

No. of Terminals: 4

With 4 terminals, this IC offers a simple and straightforward connection layout for easy integration into circuits.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE

The small outline and low profile design of this package make it ideal for compact and slim electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environments and extended use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides excellent solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position offers versatility in PCB layout and connectivity options for added flexibility.

Maximum Seated Height: 1.22 mm

The low seated height of 1.22mm allows for a compact overall design, suitable for slim devices and tight spaces.

Width (mm): 1.3 mm

The narrow width of 1.3mm enables space-efficient placement on a circuit board, optimizing board layout.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is designed specifically to support power supply functions, making it a reliable choice for power management applications.

Minimum Supply Voltage (Vsup): 1 V

The 1V minimum supply voltage enables operation in low-power scenarios, extending the range of compatible devices.

Length: 2.9 mm

With a compact length of 2.9mm, this IC is suitable for applications where space is limited.

Nominal Threshold Voltage (V): +3.08V

The nominal threshold voltage of +3.08V ensures accurate and reliable voltage regulation, enhancing system performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this IC suitable for use in demanding industrial environments with temperature fluctuations.

Maximum Supply Current (Isup): 0.01 mA

With a low maximum supply current of 0.01mA, this IC helps minimize power consumption in energy-efficient applications.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder joints and easy inspection during assembly, ensuring reliable connections.

Terminal Pitch: 1.92 mm

The 1.92mm terminal pitch offers compatibility with standard PCB designs, simplifying integration into existing systems.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC can support a wide range of power sources, making it versatile for various applications.

Technical Specifications

Power Management ICs TCM811TERCTR attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-253

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.22 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.01 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.92 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

1.3 mm

Trade Compliance

TCM811TERCTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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