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TCM809TENB713G

Microchip Technology

TCM809TENB713G by Microchip Technology

Microchip TCM809TENB713G is a Power Management IC with 3.3V supply voltage, -40 to 85°C operating temp range, and 1.12mm max seated height. It is used in industrial applications for power supply support circuits due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 382 parts In-Stock

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382

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Nova Conductors

Japan . 69 parts In-Stock

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69

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Distributors (Availability)

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Corohmni

South Africa . 92 parts In-Stock

1+ parts

$4.129

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92

$4.129

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Ampacity Inc.

Singapore . 1,474 parts In-Stock

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$5.500

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1,474

$5.500

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AZTECH Wire

Italy . 773 parts In-Stock

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$8.224

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773

$8.224

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Aztec Data Supply Inc.

USA . 3,073 parts In-Stock

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$15.258

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3,073

$15.258

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Continental Prestige Electronics

USA . 6,579 parts In-Stock

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6,579

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Marpe Global Electronics

Taiwan . 553 parts In-Stock

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553

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QualityLine Systems

Poland . 553 parts In-Stock

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553

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XL Components Corporation

Australia . 553 parts In-Stock

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553

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Aranea Global

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 347 parts In-Stock

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347

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Overview

Enhance the performance of your electronic devices with the TCM809TENB713G by Microchip Technology. Crafted with precision and expertise, this Power Management IC boasts top-notch quality and reliability. Ideal for a wide range of applications, this product offers unparalleled value, delivering efficient power supply support in a compact and durable package. Trust Microchip Technology to provide you with cutting-edge solutions that elevate your electronics to new heights. Choose the TCM809TENB713G for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, which is ideal for portable and handheld devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in many electronic devices, making this IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, increasing the product's versatility.

Width (mm): 1.3 mm

The compact width allows for efficient use of PCB space, making it suitable for space-constrained designs.

Minimum Supply Voltage (Vsup): 1 V

The ability to operate at a low supply voltage of 1V makes this IC suitable for energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and improves thermal performance, enhancing overall reliability.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC can handle higher voltage inputs, expanding its range of applications.

Technical Specifications

Power Management ICs TCM809TENB713G attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.96 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.3 mm

Trade Compliance

TCM809TENB713G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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