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TCM810ZVLB713

Microchip Technology

TCM810ZVLB713 by Microchip Technology

Microchip Technology's TCM810ZVLB713 is a Power Management IC with 2.5V supply voltage, -40 to 125°C operating temperature range, and TS 16949 screening level. It is a small outline package suitable for automotive applications requiring power supply support circuits.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 49,560 parts In-Stock

1+ parts

$0.400

100+ parts

$0.300

1k+ parts

$0.250

10k+ parts

$0.230

49,560

$0.400

$0.300

$0.250

$0.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 42,000 parts In-Stock

1+ parts

$0.230

100+ parts

$0.210

1k+ parts

$0.190

10k+ parts

-

42,000

$0.230

$0.210

$0.190

-

Chip Stock

USA . 10,170 parts In-Stock

1+ parts

-

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10,170

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Vyrian

USA . 2,038 parts In-Stock

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2,038

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Semtec, LLC

USA . 75 parts In-Stock

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75

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Nova Conductors

Japan . 10 parts In-Stock

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10

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 48,635 parts In-Stock

1+ parts

$0.414

100+ parts

-

1k+ parts

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48,635

$0.414

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$10.100

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564

$10.100

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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RGB Technical Solutions

Ukraine . 6,926 parts In-Stock

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6,926

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Kepictronics

USA . 3,250 parts In-Stock

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3,250

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Enhance your power management solutions with the TCM810ZVLB713 by Microchip Technology. Designed for reliability and performance, this Power Management IC offers unmatched quality and value. With applications in automotive and industrial settings, this product provides customers with efficient power supply support circuitry in a compact package. Trust in Microchip Technology's expertise in power management ICs and experience the benefits of seamless integration and enhanced functionality. Upgrade your systems today with the TCM810ZVLB713.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to external elements, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 2.5 V

2.5V supply voltage is a common and stable power source, ensuring consistent performance.

Screening Level: TS 16949

TS 16949 screening level signifies high quality and reliability, meeting automotive industry standards for performance and durability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to function efficiently in harsh environments without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate reliably even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and electrical conductivity, ensuring secure connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall power management efficiency.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates the product is designed to withstand automotive temperature requirements, making it suitable for automotive applications.

Technical Specifications

Power Management ICs TCM810ZVLB713 attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.025 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP3/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.32V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.25 mm

Trade Compliance

TCM810ZVLB713 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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