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TCM810TVNB713

Microchip Technology

TCM810TVNB713 by Microchip Technology

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,666 parts In-Stock

1+ parts

$0.460

100+ parts

$0.350

1k+ parts

-

10k+ parts

-

1,666

$0.460

$0.350

-

-

DigiKey

USA . 833 parts In-Stock

1+ parts

$0.460

100+ parts

$0.350

1k+ parts

-

10k+ parts

$0.350

833

$0.460

$0.350

-

$0.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,850 parts In-Stock

1+ parts

$0.643

100+ parts

$0.257

1k+ parts

$0.180

10k+ parts

$0.167

2,850

$0.643

$0.257

$0.180

$0.167

ACDS - Activité Composants Distribution Service

France . 2,850 parts In-Stock

1+ parts

-

100+ parts

-

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2,850

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Dan-Mar Components

USA . 2,850 parts In-Stock

1+ parts

-

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2,850

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,030 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

$1.838

10k+ parts

$1.838

3,030

$2.630

-

$1.838

$1.838

QUARKTWIN TECHNOLOGY LTD

USA . 24,252 parts In-Stock

1+ parts

-

100+ parts

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24,252

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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20,000

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Kepictronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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-

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Marpe Global Electronics

Taiwan . 3,930 parts In-Stock

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3,930

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QualityLine Systems

Poland . 3,930 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,930

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-

-

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XL Components Corporation

Australia . 3,930 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,930

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 2,572 parts In-Stock

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2,572

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Technical Specifications

Power Management ICs TCM810TVNB713 attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.96 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.3 mm

Trade Compliance

TCM810TVNB713 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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