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TC1301B-FDAVMFTR

Microchip Technology

TC1301B-FDAVMFTR by Microchip Technology

Microchip Technology's TC1301B-FDAVMFTR is a Fixed Positive Multiple Output LDO Regulator with 2 outputs. It offers a Max Dropout Voltage of 0.25V and 0.18V, suitable for applications requiring precise voltage regulation in compact spaces. Operating temperature range from -40 to 125°C makes it ideal for automotive and industrial electronics.

Median Price

$0.634

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.600

-

-

-

Vyrian

USA . 7,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,406

-

-

-

-

Bristol Electronics

USA . 3,295 parts In-Stock

1+ parts

-

100+ parts

$0.668

1k+ parts

$0.463

10k+ parts

-

3,295

-

$0.668

$0.463

-

Dan-Mar Components

USA . 3,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,371 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,371

$0.500

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

$0.570

10k+ parts

$0.558

1,000

$0.600

-

$0.570

$0.558

AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$6.551

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$6.551

-

-

-

West Coast Incorporated

USA . 3,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,869

-

-

-

-

Overview

Enhance your electronic designs with the TC1301B-FDAVMFTR by Microchip Technology, a top-tier manufacturer known for delivering high-quality fixed regulators. This versatile product falls under the category of Positive Multiple Output LDO, offering exceptional performance and reliability in various applications. With its innovative technology and superior packaging, this regulator ensures seamless operation even in challenging conditions. Elevate your projects with the unmatched value, benefits, and advantages that the TC1301B-FDAVMFTR brings to the table. Experience precision and efficiency like never before with this cutting-edge solution from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Maximum Dropout Voltage-2: 2.25 V

Low dropout voltage ensures efficient power conversion and minimizes energy loss.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for use in various environments and applications.

No. of Outputs: 2

Provides multiple output options, enhancing flexibility for different circuit configurations.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO TC1301B-FDAVMFTR attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Microchip Technology

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.18 V

Nominal Dropout Voltage-1:

.104 V

Maximum Dropout Voltage-2:

.25 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.01232 %

Maximum Line Regulation (%/V):

.2

Maximum Load Regulation:

.03 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.87 V

Minimum Output Voltage-1:

2.73 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

3.075 V

Minimum Output Voltage-2:

2.925 V

Nominal Output Voltage-2:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

Width:

3 mm

Trade Compliance

TC1301B-FDAVMFTR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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