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SST26VF016B-80E/SN70SVAO

Microchip Technology

SST26VF016B-80E/SN70SVAO by Microchip Technology

SST26VF016B-80E/SN70SVAO by Microchip: 16MX1 NOR Flash Memory with 104 MHz clock, SPI serial bus for automotive applications. Features 100K write/erase cycles, operates at -40 to 125 °C, and has a memory density of 16777216 bits.

Median Price

$2.180

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,500 parts In-Stock

1+ parts

$2.180

100+ parts

$2.030

1k+ parts

$1.920

10k+ parts

$1.810

3,500

$2.180

$2.030

$1.920

$1.810

DigiKey

USA . 182 parts In-Stock

1+ parts

$2.180

100+ parts

$2.128

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182

$2.180

$2.128

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NAC Semi

USA . 2,800 parts In-Stock

1+ parts

$2.340

100+ parts

$2.110

1k+ parts

$1.900

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-

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$2.340

$2.110

$1.900

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Vyrian

USA . 8,925 parts In-Stock

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8,925

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 990 parts In-Stock

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$2.000

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990

$2.000

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.123

100+ parts

$1.953

1k+ parts

$1.830

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-

5,000

$2.123

$1.953

$1.830

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Aztec Data Supply Inc.

USA . 1,542 parts In-Stock

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$2.430

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$2.430

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Semicontronic

India . 1,209 parts In-Stock

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$3.000

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$2.925

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$2.910

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Corohmni

South Africa . 324 parts In-Stock

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$5.378

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AZTECH Wire

Italy . 482 parts In-Stock

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$10.125

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QualityLine Systems

Poland . 8,254 parts In-Stock

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XL Components Corporation

Australia . 7,963 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,574 parts In-Stock

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Continental Prestige Electronics

USA . 4,757 parts In-Stock

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Microchip USA

USA . 2,628 parts In-Stock

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Argo Parts USA

USA . 1,406 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the SST26VF016B-80E/SN70SVAO by Microchip Technology. Designed for automotive applications, this NOR type memory offers 16M words of storage, ensuring optimal performance and data retention. With a maximum clock frequency of 104 MHz and endurance of 100,000 write/erase cycles, this flash memory is perfect for demanding environments. Trust in Microchip Technology's expertise and experience to deliver top-notch solutions that meet your needs. Experience the value and benefits that this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, making it suitable for various environments.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and making the assembly process more efficient.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures better performance and data transfer speed, making the flash memory efficient for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, ensuring compatibility with a wide range of systems and devices.

Write Protection: HARDWARE/SOFTWARE

Offers flexibility in data protection, allowing users to choose between hardware or software-based write protection for added security.

Maximum Clock Frequency (fCLK): 104 MHz

Supports high clock frequencies, enabling faster data access and transfer speeds for improved overall performance.

Endurance: 100000 Write/Erase Cycles

Withstands a high number of write/erase cycles, ensuring reliable and long-lasting operation for frequent data updates.

Serial Bus Type: SPI

Utilizes the SPI communication interface, which is widely supported and provides efficient data transfer between the flash memory and the host system.

Technical Specifications

Flash Memory SST26VF016B-80E/SN70SVAO attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000045 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST26VF016B-80E/SN70SVAO Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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