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PIC32MX270F256DT-50I/ML

Microchip Technology

PIC32MX270F256DT-50I/ML by Microchip Technology

PIC32MX270F256DT-50I/ML by Microchip: 32-bit RISC CPU, 262144 ROM words, 65536 RAM bytes. Ideal for industrial applications requiring high-speed processing and low power consumption. Features 13-Ch ADC, 4 DMA channels, and multiple connectivity options like I2C, SPI, UART.

Median Price

$6.601

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,585 parts In-Stock

1+ parts

$6.350

100+ parts

$5.760

1k+ parts

$5.270

10k+ parts

-

1,585

$6.350

$5.760

$5.270

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$6.851

100+ parts

-

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900

$6.851

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Vyrian

USA . 2,570 parts In-Stock

1+ parts

-

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2,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,541 parts In-Stock

1+ parts

$5.210

100+ parts

$5.080

1k+ parts

$5.054

10k+ parts

-

1,541

$5.210

$5.080

$5.054

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Ampacity Inc.

Singapore . 1,184 parts In-Stock

1+ parts

$5.210

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1,184

$5.210

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Continental Prestige Electronics

USA . 3,995 parts In-Stock

1+ parts

$6.851

100+ parts

-

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10k+ parts

$6.714

3,995

$6.851

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-

$6.714

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$6.851

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-

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2,000

$6.851

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.988

100+ parts

$6.988

1k+ parts

$6.988

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500

$6.988

$6.988

$6.988

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AZTECH Wire

Italy . 1,186 parts In-Stock

1+ parts

$8.630

100+ parts

-

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1,186

$8.630

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Aztec Data Supply Inc.

USA . 4,093 parts In-Stock

1+ parts

$78.400

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4,093

$78.400

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Corohmni

South Africa . 349 parts In-Stock

1+ parts

$82.490

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349

$82.490

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Argo Parts USA

USA . 4,992 parts In-Stock

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4,992

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RGB Technical Solutions

Ukraine . 1,328 parts In-Stock

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1,328

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Overview

Experience the unparalleled performance and reliability of the PIC32MX270F256DT-50I/ML microcontroller from industry leader Microchip Technology. This innovative device offers a wide range of applications in various industries, thanks to its advanced technology and high-quality manufacturing standards. With features like low power mode, multiple peripherals, and high-speed processing capabilities, this microcontroller delivers exceptional value and benefits to customers looking for top-of-the-line performance in their electronic devices. Trust Microchip Technology to provide you with cutting-edge solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and can handle higher voltage inputs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides faster execution of instructions, making the product efficient and suitable for various applications.

Maximum Clock Frequency: 50 MHz

High clock frequency enables faster processing speeds and performance of the microcontroller.

Analog To Digital Convertors: 13-Ch 10-Bit

Multiple ADC channels with high resolution allow for accurate conversion of analog signals to digital data, enhancing the functionality of the product.

RAM Bytes: 65536

Ample RAM size enables the microcontroller to handle complex tasks and store large amounts of data efficiently.

Technical Specifications

Microcontrollers PIC32MX270F256DT-50I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX270F256DT-50I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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