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PIC16F18426-E/ST

Microchip Technology

PIC16F18426-E/ST by Microchip Technology

PIC16F18426-E/ST by Microchip: 8-bit microcontroller with 32MHz clock, 256B EEPROM, and 12 I/O lines. Ideal for automotive applications due to -40 to 125°C operating temp range and TS16949 screening level. Features include 11-Ch ADC, 1-Ch DAC, and low power mode for efficient performance.

Median Price

$1.610

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 492 parts In-Stock

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$1.610

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$1.340

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$1.230

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$1.170

492

$1.610

$1.340

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$1.170

DigiKey

USA . 266 parts In-Stock

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$1.610

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$1.340

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Nova Conductors

Japan . 38 parts In-Stock

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$1.526

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Vyrian

USA . 6,376 parts In-Stock

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Chip Stock

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Semicontronic

India . 2,321 parts In-Stock

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$1.370

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$1.336

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$1.329

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$1.329

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Ampacity Inc.

Singapore . 2,172 parts In-Stock

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$1.370

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Corohmni

South Africa . 352 parts In-Stock

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$1.458

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Aranea Global

USA . 2,000 parts In-Stock

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$1.495

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$1.435

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Continental Prestige Electronics

USA . 1,239 parts In-Stock

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$1.526

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Argo Parts USA

USA . 208 parts In-Stock

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Aztec Data Supply Inc.

USA . 34,925 parts In-Stock

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Lixinc

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LMD Electronica

Estonia . 7,200 parts In-Stock

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NIA Electronics

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Ledger Components

France . 2,414 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,014 parts In-Stock

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iodParts Technologies Inc.

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Montano Global Distributors

Canada . 142 parts In-Stock

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Overview

Unlock endless possibilities with the Microchip Technology PIC16F18426-E/ST microcontroller! Manufactured by a trusted leader in the industry, this powerful device offers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller boasts innovative features and cutting-edge technology that ensure reliability and efficiency. Experience the value and benefits of this versatile product and revolutionize your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product.

Surface Mount: YES

Easy installation and space-saving design.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltages.

On Chip Data RAM Width: 8

Efficient data processing capabilities.

Screening Level: TS 16949

High quality standards for performance and reliability.

Package Shape: RECTANGULAR

Space-efficient design for compact devices.

Bit Size: 8

Ideal for handling smaller data operations effectively.

DAC Channels: YES

Enables accurate analog signal outputs.

No. of Terminals: 14

Sufficient for connecting to various external components.

Package Style: SMALL OUTLINE ...

Slim and compact package for versatile applications.

Minimum Supply Voltage: 2.5 V

Can operate efficiently at lower power levels.

Maximum Operating Temperature: 125 °C

Suitable for operation in high-temperature environments.

CPU Family: PIC16

Known for its reliability, performance, and versatility.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions.

Terminal Finish: MATTE TIN

Provides a reliable connection with other components.

ADC Channels: YES

Capable of converting analog signals accurately.

Terminal Position: DUAL

Allows for flexible and secure connections.

ROM Words: 16384

Offers ample storage capacity for programming.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Digital To Analog Convertors: 1-Ch 5-Bit

Provides precise conversion of digital signals to analog outputs.

Width: 4.4 mm

Compact size suitable for small electronic devices.

Data EEPROM Size: 256

Sufficient storage for data retention.

Peripherals: BOR, CLC(4), ...

Offers a wide range of peripheral options for enhanced functionality.

Maximum Clock Frequency: 32 MHz

High processing speed for rapid data manipulation.

Maximum Time At Peak Reflow Temperature: 30s

Can withstand high-temperature soldering processes.

Peak Reflow Temperature: 260 °C

Suitable for lead-free soldering processes.

Length: 5 mm

Compact size for smaller device designs.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications requiring rugged performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Ideal for embedded systems with high processing requirements.

No. of Timers: 9

Provides multiple timing options for diverse applications.

RAM Bytes: 2048

Sufficient memory for storing and processing data.

Technology: CMOS

Offers low power consumption and high-speed operation.

Terminal Form: GULL WING

Secure and reliable terminal connection.

Analog To Digital Convertors: 11-Ch 12-Bit

Accurate conversion of analog signals to digital data.

Maximum Supply Current: 4.8 mA

Energy-efficient operation.

Nominal Supply Voltage: 3 V

Standard voltage supply for easy integration.

PWM Channels: YES

Enables precise control of pulse-width modulation outputs.

Connectivity: EUSART, LIN, MSSP(2)

Versatile options for communication interfaces.

ROM Programmability: FLASH

Allows for flexible programming and updates.

Terminal Pitch: 0.65 mm

Suitable for fine pitch assembly requirements.

Format: FIXED POINT

Ideal for numerical calculations with fixed precision.

Speed: 32 rpm

High clock frequency for fast operation.

Low Power Mode: YES

Energy-saving feature for extended battery life.

On Chip Program ROM Width: 14

Wide data width for efficient program storage.

No. of I/O Lines: 12

Sufficient input and output options for diverse connectivity.

Technical Specifications

Microcontrollers PIC16F18426-E/ST attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 2.3V MIN AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

1

No. of Terminals:

14

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Current:

4.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

EUSART, LIN, MSSP(2)

Peripherals:

BOR, CLC(4), COMPARATOR(2), POR, PWM(2), TIMER(9), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F18426-E/ST Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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