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MXLPLAD30KP400CA

Microchip Technology

MXLPLAD30KP400CA by Microchip Technology

Microchip Technology's MXLPLAD30KP400CA is a single bidirectional avalanche diode with 30000W peak power dissipation. It has a breakdown voltage of 468V and max clamping voltage of 644V. Ideal for transient suppression in applications requiring high surge protection like industrial equipment and power supplies.

Median Price

$65.040

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$65.040

100+ parts

-

1k+ parts

-

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10

$65.040

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-

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Vyrian

USA . 495 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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495

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.094

100+ parts

$0.086

1k+ parts

$0.077

10k+ parts

-

60

$0.094

$0.086

$0.077

-

Ampacity Inc.

Singapore . 889 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

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889

$1.010

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$16.104

100+ parts

-

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495

$16.104

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Netroflash

USA . 100 parts In-Stock

1+ parts

$65.040

100+ parts

-

1k+ parts

$61.788

10k+ parts

$60.487

100

$65.040

-

$61.788

$60.487

Component Stockers USA

USA . 66 parts In-Stock

1+ parts

$1,277.490

100+ parts

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10k+ parts

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66

$1,277.490

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RGB Technical Solutions

Ukraine . 3,793 parts In-Stock

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3,793

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Overview

Discover the power of the Microchip Technology MXLPLAD30KP400CA Transient Suppression Device. Crafted with precision and excellence, this product is designed to protect your valuable electronics from voltage spikes and surges. Whether you're in need of reliable protection for industrial equipment, telecommunications systems, or consumer electronics, this device offers unparalleled performance and peace of mind. Trust in the quality and expertise of Microchip Technology to safeguard your investments and keep your devices running smoothly. Choose the MXLPLAD30KP400CA for superior protection and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the device, making it suitable for various applications.

Maximum Non Repetitive Peak Reverse Power Dissipation: 30000 W

With a high maximum non-repetitive peak reverse power dissipation, this device can effectively handle sudden spikes or surges in power, protecting connected equipment from damage.

Nominal Breakdown Voltage: 468 V

The nominal breakdown voltage of 468V ensures that the device can effectively suppress voltage spikes and protect sensitive electronics from overvoltage conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the device to function reliably even in extreme temperature conditions, expanding its range of applications.

Reference Standard: IEC-61000-4-2, 4-4, 4-5; MIL-19500

Compliance with industry standards such as IEC and MIL ensures the reliability and performance of the device, making it a trusted choice for transient suppression applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diodes ensures efficient suppression of voltage spikes and transient events, providing reliable protection for connected devices.

Technical Specifications

Transient Suppression Devices MXLPLAD30KP400CA attributes and parameters. Explore more Transient Suppression Devices devices from Microchip Technology

Specs

Additional Features:

HIGH RELIABILITY

Maximum Breakdown Voltage:

492 V

Minimum Breakdown Voltage:

444 V

Nominal Breakdown Voltage:

468 V

Maximum Clamping Voltage:

644 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

S-PSSO-G1

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

30000 W

No. of Elements:

1

No. of Terminals:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

2.5 W

Qualification:

Not Qualified

Reference Standard:

IEC-61000-4-2, 4-4, 4-5; MIL-19500

Maximum Repetitive Peak Reverse Voltage:

400 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Trade Compliance

MXLPLAD30KP400CA Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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