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MXLPLAD6.5KP18CAE3

Microchip Technology

MXLPLAD6.5KP18CAE3 by Microchip Technology

MXLPLAD6.5KP18CAE3 by Microchip Technology is a Transient Suppression Device with 6500W power dissipation, operating from -55 to 150°C. It features a bidirectional diode element made of silicon for applications requiring protection against voltage spikes in automotive and military electronics.

Median Price

$10.622

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 600 parts In-Stock

1+ parts

$10.622

100+ parts

$10.622

1k+ parts

$10.622

10k+ parts

-

600

$10.622

$10.622

$10.622

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$10.413

100+ parts

-

1k+ parts

-

10k+ parts

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53

$10.413

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-

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Vyrian

USA . 247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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247

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,632 parts In-Stock

1+ parts

$0.052

100+ parts

-

1k+ parts

-

10k+ parts

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3,632

$0.052

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-

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Corohmni

South Africa . 176 parts In-Stock

1+ parts

$0.061

100+ parts

-

1k+ parts

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10k+ parts

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176

$0.061

-

-

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Ampacity Inc.

Singapore . 169 parts In-Stock

1+ parts

$9.030

100+ parts

-

1k+ parts

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10k+ parts

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169

$9.030

-

-

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AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$9.754

100+ parts

-

1k+ parts

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247

$9.754

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-

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Continental Prestige Electronics

USA . 3,473 parts In-Stock

1+ parts

$10.413

100+ parts

-

1k+ parts

-

10k+ parts

$10.205

3,473

$10.413

-

-

$10.205

Netroflash

USA . 50 parts In-Stock

1+ parts

$10.413

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$10.413

-

-

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$10.622

100+ parts

$10.622

1k+ parts

$10.622

10k+ parts

-

600

$10.622

$10.622

$10.622

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QualityLine Systems

Poland . 6,816 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,816

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-

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XL Components Corporation

Australia . 4,277 parts In-Stock

1+ parts

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100+ parts

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4,277

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-

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Argo Parts USA

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,240

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Marpe Global Electronics

Taiwan . 840 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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840

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Overview

Experience superior protection and reliability with the MXLPLAD6.5KP18CAE3 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-of-the-line Transient Suppression Devices that guarantee peace of mind for your electronic components. Whether you need surge protection for automotive applications or industrial equipment, this product offers unmatched quality and performance. Trust in Microchip Technology to provide innovative solutions that ensure the longevity and efficiency of your devices. Upgrade to the MXLPLAD6.5KP18CAE3 today and safeguard your investments with the best in the business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the device, making it suitable for various operating environments.

Maximum Non Repetitive Peak Reverse Power Dissipation: 6500 W

With a high power dissipation capability, this device can handle sudden power surges effectively, protecting the connected equipment.

Maximum Operating Temperature: 150 °C

The device can operate efficiently at high temperatures, ensuring reliability in harsh conditions.

Reference Standard: AEC-Q101; MIL-19500

Compliance with industry standards ensures the quality and performance of the product, making it a trusted choice for applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diodes helps in quickly clamping transient voltage spikes, safeguarding sensitive electronics.

Technical Specifications

Transient Suppression Devices MXLPLAD6.5KP18CAE3 attributes and parameters. Explore more Transient Suppression Devices devices from Microchip Technology

Specs

Additional Features:

HIGH RELIABILITY

Maximum Breakdown Voltage:

22.1 V

Minimum Breakdown Voltage:

20 V

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

S-PSSO-G1

JESD-609 Code:

e3

Maximum Non Repetitive Peak Reverse Power Dissipation:

6500 W

No. of Elements:

1

No. of Terminals:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

2.5 W

Reference Standard:

AEC-Q101; MIL-19500

Maximum Repetitive Peak Reverse Voltage:

18 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

MXLPLAD6.5KP18CAE3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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