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MXLPLAD7.5KP30CAE3

Microchip Technology

MXLPLAD7.5KP30CAE3 by Microchip Technology

Microchip Technology's MXLPLAD7.5KP30CAE3 is a Trans Voltage Suppressor Diode with 7500W power dissipation, 35.05V breakdown voltage, and 10uA reverse current. Ideal for transient suppression in automotive electronics, meeting AEC-Q101 standards and operating from -55°C to 150°C.

Median Price

$11.430

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$11.430

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$11.430

-

-

-

Vyrian

USA . 758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

758

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 507 parts In-Stock

1+ parts

$0.010

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$0.010

-

-

-

Aztec Data Supply Inc.

USA . 2,513 parts In-Stock

1+ parts

$0.037

100+ parts

-

1k+ parts

-

10k+ parts

-

2,513

$0.037

-

-

-

Corohmni

South Africa . 109 parts In-Stock

1+ parts

$0.062

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$0.062

-

-

-

AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$11.041

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$11.041

-

-

-

Continental Prestige Electronics

USA . 2,087 parts In-Stock

1+ parts

$11.430

100+ parts

-

1k+ parts

-

10k+ parts

$11.201

2,087

$11.430

-

-

$11.201

West Coast Incorporated

USA . 4,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,461

-

-

-

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Argo Parts USA

USA . 961 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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961

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-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$11.201

1k+ parts

$10.859

10k+ parts

$10.630

500

-

$11.201

$10.859

$10.630

Overview

Experience superior protection with the MXLPLAD7.5KP30CAE3 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers high-quality transient suppression devices like this one, designed for various applications. Protect your electronic equipment from voltage spikes and surges with this product, offering unmatched value and reliability. Ensure peace of mind knowing that your devices are safeguarded with the MXLPLAD7.5KP30CAE3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the device, making it suitable for various environments and applications.

Maximum Non Repetitive Peak Reverse Power Dissipation: 7500 W

Capable of handling high power surges and offering reliable protection for sensitive electronic components.

Nominal Breakdown Voltage: 35.05 V

Consistent breakdown voltage ensures effective suppression of transient voltage spikes.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments, providing stability and reliability in extreme conditions.

Terminal Finish: MATTE TIN

Allows for good solderability and electrical conductivity, ensuring secure connections for the device.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specifically designed for transient suppression, providing efficient protection against voltage spikes.

Technical Specifications

Transient Suppression Devices MXLPLAD7.5KP30CAE3 attributes and parameters. Explore more Transient Suppression Devices devices from Microchip Technology

Specs

Additional Features:

HIGH RELIABILITY

Maximum Breakdown Voltage:

36.8 V

Minimum Breakdown Voltage:

33.3 V

Nominal Breakdown Voltage:

35.05 V

Case Connection:

CATHODE

Maximum Clamping Voltage:

48.4 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

S-PSSO-G1

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

7500 W

No. of Elements:

1

No. of Terminals:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

2.5 W

Reference Standard:

AEC-Q101; IEC-61000-4-2, 4-4, 4-5; MIL-19500

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Current:

10 uA

Reverse Test Voltage:

30 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

MXLPLAD7.5KP30CAE3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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