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MXLPLAD30KP400A

Microchip Technology

MXLPLAD30KP400A by Microchip Technology

MXLPLAD30KP400A by Microchip Tech is a unidirectional TRANS VOLTAGE SUPPRESSOR DIODE with 30000W power dissipation, 468V breakdown voltage, and 644V clamping voltage. Ideal for transient suppression in electronics to protect against voltage spikes.

Median Price

$54.880

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$54.880

100+ parts

-

1k+ parts

-

10k+ parts

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50

$54.880

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-

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Vyrian

USA . 515 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,573 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

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1,573

$2.010

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$8.860

100+ parts

-

1k+ parts

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515

$8.860

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$53.782

100+ parts

-

1k+ parts

$51.631

10k+ parts

-

500

$53.782

-

$51.631

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QualityLine Systems

Poland . 4,124 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,124

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Marpe Global Electronics

Taiwan . 748 parts In-Stock

1+ parts

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748

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XL Components Corporation

Australia . 409 parts In-Stock

1+ parts

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409

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Overview

Experience superior protection against voltage spikes with the MXLPLAD30KP400A by Microchip Technology. As a leader in transient suppression devices, Microchip delivers top-quality products that are designed for reliability and performance. With a maximum clamping voltage of 644V and a nominal breakdown voltage of 468V, this product is perfect for a wide range of applications. Trust Microchip to provide you with the best solution for your voltage protection needs, ensuring peace of mind and uninterrupted operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the components inside, ensuring durability and reliability.

Maximum Non Repetitive Peak Reverse Power Dissipation: 30000 W

High power dissipation capability allows the device to handle large voltage spikes and surges, protecting connected equipment effectively.

Nominal Breakdown Voltage: 468 V

The nominal breakdown voltage ensures that the device kicks into action at the specified voltage level, safeguarding against overvoltage conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this device can withstand harsh environmental conditions and remain functional under extreme temperatures.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of Transient Voltage Suppressor (TVS) diode technology provides fast response times and efficient protection against voltage transients, making it suitable for transient suppression applications.

Technical Specifications

Transient Suppression Devices MXLPLAD30KP400A attributes and parameters. Explore more Transient Suppression Devices devices from Microchip Technology

Specs

Additional Features:

HIGH RELIABILITY

Maximum Breakdown Voltage:

492 V

Minimum Breakdown Voltage:

444 V

Nominal Breakdown Voltage:

468 V

Case Connection:

CATHODE

Maximum Clamping Voltage:

644 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

S-PSSO-G1

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

30000 W

No. of Elements:

1

No. of Terminals:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

2.5 W

Qualification:

Not Qualified

Reference Standard:

IEC-61000-4-2, 4-4, 4-5; MIL-19500

Maximum Repetitive Peak Reverse Voltage:

400 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Trade Compliance

MXLPLAD30KP400A Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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