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MSC040SMA120J

Microchip Technology

MSC040SMA120J by Microchip Technology

MSC040SMA120J by Microchip is a N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. It features a max IDM of 105A and ID of 53A, with 0.05ohm RDS(on). Operating in enhancement mode, it has a max power dissipation of 208W and can withstand temperatures from -55 to 175°C.

Median Price

$40.740

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 635 parts In-Stock

1+ parts

$40.740

100+ parts

$30.700

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635

$40.740

$30.700

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Microchip Technology

USA . 510 parts In-Stock

1+ parts

$40.740

100+ parts

$32.690

1k+ parts

$30.500

10k+ parts

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510

$40.740

$32.690

$30.500

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Mouser Electronics

USA . 60 parts In-Stock

1+ parts

$40.740

100+ parts

$32.690

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60

$40.740

$32.690

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Verical

USA . 20 parts In-Stock

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20

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EBV Elektronik

Germany . 10 parts In-Stock

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10

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Distributors (In-Stock)

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NAC Semi

USA . 890 parts In-Stock

1+ parts

$34.840

100+ parts

$32.090

1k+ parts

$29.740

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890

$34.840

$32.090

$29.740

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TME

Poland . 20 parts In-Stock

1+ parts

$54.310

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20

$54.310

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Vyrian

USA . 4,599 parts In-Stock

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4,599

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 134 parts In-Stock

1+ parts

$34.550

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134

$34.550

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Microchip USA

USA . 3,429 parts In-Stock

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$93.702

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3,429

$93.702

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RGB Technical Solutions

Ukraine . 3,191 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Experience the power of innovation with the MSC040SMA120J by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality Power Field Effect Transistors that are ideal for switching applications. With a high DS Breakdown Voltage of 1200V and a Maximum Pulsed Drain Current of 105A, this N-CHANNEL transistor offers unparalleled performance and reliability. Whether you're looking to optimize your power management system or enhance your industrial equipment, the MSC040SMA120J provides the value, benefits, and advantages that customers need to succeed. Trust in Microchip Technology to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand high temperatures, making the FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage applications without the risk of damage.

Maximum Pulsed Drain Current (IDM): 105 A

The high pulsed drain current allows for handling sudden spikes in current, making this FET suitable for applications with varying loads.

Maximum Power Dissipation (Abs): 208 W

This FET can dissipate high power while maintaining efficiency, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand heat without performance degradation, making it reliable in various environments.

Maximum Drain-Source On Resistance: 0.05 ohm

Low ON resistance results in reduced power losses and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) MSC040SMA120J attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

53 A

Maximum Drain Current (ID):

53 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

17 pF

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

105 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSC040SMA120J Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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