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MSC035SMA170S

Microchip Technology

MSC035SMA170S by Microchip Technology

MSC035SMA170S by Microchip Technology is a N-CHANNEL FET with 1700V DS breakdown voltage, ideal for switching applications. It features a max IDM of 200A and 0.045 ohm RDS(on), operating in enhancement mode. With a package style of small outline, it utilizes silicon carbide technology for high power dissipation up to 278W at 175°C.

Median Price

$35.130

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 20 parts In-Stock

1+ parts

$29.530

100+ parts

$27.090

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20

$29.530

$27.090

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Mouser Electronics

USA . 217 parts In-Stock

1+ parts

$35.130

100+ parts

$31.810

1k+ parts

$31.440

10k+ parts

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217

$35.130

$31.810

$31.440

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Microchip Technology

USA . 510 parts In-Stock

1+ parts

$41.500

100+ parts

$33.300

1k+ parts

$31.060

10k+ parts

-

510

$41.500

$33.300

$31.060

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DigiKey

USA . 34 parts In-Stock

1+ parts

$41.500

100+ parts

$33.300

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-

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34

$41.500

$33.300

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Richardson RFPD

USA . 30 parts In-Stock

1+ parts

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$33.380

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30

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$33.380

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Verical

USA . 20 parts In-Stock

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20

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Distributors (In-Stock)

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Electro Sonic

Canada . 30 parts In-Stock

1+ parts

$38.830

100+ parts

$31.900

1k+ parts

$30.950

10k+ parts

-

30

$38.830

$31.900

$30.950

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IBS Electronics

USA . 20 parts In-Stock

1+ parts

$41.416

100+ parts

$38.120

1k+ parts

$37.910

10k+ parts

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20

$41.416

$38.120

$37.910

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Vyrian

USA . 4,049 parts In-Stock

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4,049

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Corohmni

South Africa . 374 parts In-Stock

1+ parts

$0.405

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374

$0.405

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Ampacity Inc.

Singapore . 97 parts In-Stock

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$29.000

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97

$29.000

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XL Components Corporation

Australia . 7,947 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,539 parts In-Stock

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Argo Parts USA

USA . 3,032 parts In-Stock

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QualityLine Systems

Poland . 1,844 parts In-Stock

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Continental Prestige Electronics

USA . 1,065 parts In-Stock

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1,065

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MSC035SMA170S by Microchip Technology. As a leading manufacturer in the industry, Microchip's Power Field Effect Transistors (FET) offer unparalleled quality and reliability. Ideal for switching applications, this N-CHANNEL transistor features a single configuration with a built-in diode for seamless operation. With a high DS Breakdown Voltage of 1700V and a maximum Pulsed Drain Current of 200A, this transistor delivers exceptional performance. Experience the benefits of enhanced mode operation and efficient power dissipation with the MSC035SMA170S, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency.

Transistor Application: SWITCHING

The switching capability allows for efficient control and regulation of power flow.

Minimum DS Breakdown Voltage: 1700 V

This high breakdown voltage ensures reliable performance in high voltage applications.

Surface Mount: YES

Surface mount technology facilitates easy installation and space-saving in circuit designs.

Maximum Power Dissipation (Abs): 278 W

The high power dissipation capacity allows the transistor to handle heavy loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high switching speeds and low power consumption.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures reliability in harsh environmental conditions.

Transistor Element Material: SILICON CARBIDE

Silicon carbide offers high thermal conductivity and durability, enhancing the transistor's performance.

Maximum Drain-Source On Resistance: 0.045 ohm

The low on-resistance results in minimal power loss and efficient switching.

Technical Specifications

Power Field Effect Transistors (FET) MSC035SMA170S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1700 V

Maximum Drain Current (ID):

59 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-268AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSC035SMA170S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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