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LE9642PQC

Microchip Technology

LE9642PQC by Microchip Technology

SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$3.430

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 311,939 parts In-Stock

1+ parts

$3.430

100+ parts

$2.600

1k+ parts

$2.510

10k+ parts

$2.480

311,939

$3.430

$2.600

$2.510

$2.480

Mouser Electronics

USA . 1,261 parts In-Stock

1+ parts

$3.430

100+ parts

$2.770

1k+ parts

-

10k+ parts

-

1,261

$3.430

$2.770

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-

DigiKey

USA . 1,191 parts In-Stock

1+ parts

$3.430

100+ parts

$2.763

1k+ parts

-

10k+ parts

-

1,191

$3.430

$2.763

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 33,500 parts In-Stock

1+ parts

-

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33,500

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-

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Cyclops Electronics Ltd

UK . 739 parts In-Stock

1+ parts

-

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739

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J2 Sourcing AB

Sweden . 320 parts In-Stock

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320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Formix International (Excess)

India . 58,313 parts In-Stock

1+ parts

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100+ parts

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58,313

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Infinite Electronics LLP (Excess)

. 46,382 parts In-Stock

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46,382

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A-Z Elektronik GmbH

Germany . 4,791 parts In-Stock

1+ parts

-

100+ parts

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4,791

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Kepictronics

USA . 3,800 parts In-Stock

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3,800

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Alle Elektronik GmbH

Germany . 3,194 parts In-Stock

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3,194

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Fulton Briggs Corp.

USA . 1,563 parts In-Stock

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1,563

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Futuretech Components

Singapore . 128 parts In-Stock

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128

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Technical Specifications

Analog Data Transmission Interfaces LE9642PQC attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Microchip Technology

Specs

Battery Feed:

CONSTANT CURRENT

Battery Supply (V):

-40 TO -25

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Maximum Noise:

19 dBrnC

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

32 dB

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LE9642PQC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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