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KSZ8873RLLU

Microchip Technology

KSZ8873RLLU by Microchip Technology

Microchip Technology's KSZ8873RLLU is a LAN switching circuit with 64 terminals. It operates at -40 to 85°C, ideal for industrial applications. The IC has a nominal voltage of 3.3V and comes in a low-profile flatpack package suitable for telecom switching systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,226 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 657 parts In-Stock

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$8.060

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Corohmni

South Africa . 317 parts In-Stock

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$12.034

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Aztec Data Supply Inc.

USA . 2,748 parts In-Stock

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$16.773

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$16.773

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Ampacity Inc.

Singapore . 144 parts In-Stock

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$360.000

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Semicontronic

India . 359 parts In-Stock

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$493.000

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$480.675

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$478.210

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Kepictronics

USA . 26,100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,287 parts In-Stock

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Continental Prestige Electronics

USA . 6,053 parts In-Stock

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QualityLine Systems

Poland . 5,886 parts In-Stock

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Argo Parts USA

USA . 4,721 parts In-Stock

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XL Components Corporation

Australia . 4,405 parts In-Stock

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Marpe Global Electronics

Taiwan . 3,340 parts In-Stock

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Advanced Electronics

New Zealand . 2,632 parts In-Stock

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Microchip USA

USA . 1,508 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Upgrade your networking capabilities with the Microchip Technology KSZ8873RLLU LAN switching circuit. Designed for industrial-grade applications, this telecom IC offers unparalleled reliability and performance. With a sleek and compact flatpack design, this switch IC is perfect for space-constrained environments. Trust in Microchip Technology's reputation for quality and innovation to take your networking to the next level. Experience faster data transfer speeds, improved connectivity, and seamless network management with the KSZ8873RLLU. Choose Microchip Technology for superior telecom solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Facilitates easy and efficient PCB assembly.

Screening Level: AEC-Q100; TS 16949

Ensures high quality and reliability, meeting industry standards.

Package Shape: SQUARE

Enables efficient use of space on the PCB.

No. of Terminals: 64

Offers flexibility and functionality for connectivity options in the circuit.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Optimizes space usage and allows for high-density mounting.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions.

Minimum Operating Temperature: -40 °C

Ensures the product can operate in a wide range of temperature conditions.

Terminal Position: QUAD

Provides stability and ease of connection.

Maximum Seated Height: 1.6 mm

Allows for a low-profile design, saving space in the system.

Width: 10 mm

Compact size for efficient placement on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes the manufacturing process by specifying the required reflow time.

Peak Reflow Temperature °C: 260

Ensures proper soldering during assembly for a reliable connection.

Length: 10 mm

Compact size for efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments where temperature fluctuations may occur.

Terminal Form: GULL WING

Provides a stable and secure connection on the PCB.

Telecom IC Type: LAN SWITCHING CIRCUIT

Specifically designed for LAN switching applications, ensuring optimal performance.

Nominal Supply Voltage: 3.3 V

Compatible with common voltage standards in telecom applications.

Terminal Pitch: 0.5 mm

Provides a fine pitch for high-density mounting and space-saving on the PCB.

Technical Specifications

Telecom - Switching ICs KSZ8873RLLU attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

KSZ8873RLLU Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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