Loading...

KSZ8873MLLAM

Microchip Technology

KSZ8873MLLAM by Microchip Technology

Microchip Technology's KSZ8873MLLAM is a LAN switching circuit with 64 terminals in a low profile, fine pitch flatpack. Operating temperature ranges from -40 to 85°C, making it suitable for industrial applications. With AEC-Q100 screening level and TS 16949 certification, it is ideal for telecom switching ICs.

Median Price

$6.430

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$6.430

-

-

-

Vyrian

USA . 8,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,297

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$6.301

100+ parts

-

1k+ parts

$6.049

10k+ parts

-

500

$6.301

-

$6.049

-

Continental Prestige Electronics

USA . 1,161 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

$6.301

1,161

$6.430

-

-

$6.301

Ampacity Inc.

Singapore . 160 parts In-Stock

1+ parts

$8.440

100+ parts

-

1k+ parts

-

10k+ parts

-

160

$8.440

-

-

-

Corohmni

South Africa . 215 parts In-Stock

1+ parts

$16.557

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$16.557

-

-

-

AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$17.820

100+ parts

-

1k+ parts

-

10k+ parts

-

316

$17.820

-

-

-

Semicontronic

India . 160 parts In-Stock

1+ parts

$18.370

100+ parts

$17.911

1k+ parts

$17.819

10k+ parts

-

160

$18.370

$17.911

$17.819

-

Component Stockers USA

USA . 599 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$99.990

-

-

-

Kepictronics

USA . 26,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,091

-

-

-

-

Lixinc

USA . 19,474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,474

-

-

-

-

LOOK Integrated Logistics

Peru . 7,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,192

-

-

-

-

Montano Global Distributors

Canada . 5,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,557

-

-

-

-

Microchip USA

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,063

-

-

-

-

Argo Parts USA

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,890

-

-

-

-

LMD Electronica

Estonia . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

NIA Electronics

USA . 881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

881

-

-

-

-

Ledger Components

France . 881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

881

-

-

-

-

Perfect Parts

USA . 790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

790

-

-

-

-

Overview

Elevate your telecom systems with the Microchip Technology KSZ8873MLLAM LAN switching circuit. Designed with precision and quality in mind, this Telecom - Switching IC offers seamless connectivity and enhanced performance for your networking needs. With a focus on reliability and efficiency, Microchip Technology ensures that every product meets the highest industry standards, making it ideal for a wide range of applications. Experience the value and benefits that the KSZ8873MLLAM brings to the table, from its compact design to its industrial-grade temperature tolerance. Upgrade your network infrastructure today with Microchip Technology's cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability to the product, making it suitable for long term use in telecom applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and facilitating mass production of telecom equipment.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive quality standards ensures high performance and reliability of the product, making it a trusted choice for demanding telecom applications.

No. of Terminals: 64

With a high number of terminals, this switching IC offers versatile connectivity options, enabling complex telecom network configurations.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The compact and low profile package style with fine pitch terminals allows for efficient use of space on the PCB, essential for densely packed telecom equipment.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this switching IC can perform reliably in challenging environmental conditions often encountered in telecom systems.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures that the switching IC remains functional even in extreme cold conditions, crucial for telecom applications in various climates.

Nominal Supply Voltage: 1.8 V

With a low supply voltage requirement, this switching IC offers energy efficiency and reduces power consumption in telecom equipment, contributing to overall cost savings.

Technical Specifications

Telecom - Switching ICs KSZ8873MLLAM attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

KSZ8873MLLAM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20