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KSZ8051MLLI-TR

Microchip Technology

KSZ8051MLLI-TR by Microchip Technology

Microchip Technology's KSZ8051MLLI-TR is an Ethernet transceiver IC with a data rate of 100 Mbps. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications. The package style is flatpack, low profile, fine pitch with a terminal pitch of 0.5 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,744 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

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$7.940

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110

$7.940

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Corohmni

South Africa . 532 parts In-Stock

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$9.563

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532

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AZTECH Wire

Italy . 749 parts In-Stock

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$11.027

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Ampacity Inc.

Singapore . 1,396 parts In-Stock

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$929.000

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West Coast Incorporated

USA . 7,673 parts In-Stock

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Continental Prestige Electronics

USA . 5,761 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 1,971 parts In-Stock

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Argo Parts USA

USA . 754 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock unparalleled networking capabilities with the Microchip Technology KSZ8051MLLI-TR Ethernet Transceiver. Crafted with precision by a trusted industry leader, this network interface device delivers seamless connectivity, robust performance, and unmatched reliability. Ideal for a wide range of applications, this Ethernet transceiver is designed to exceed expectations and elevate your networking experience. Experience the power of cutting-edge technology with the Microchip Technology KSZ8051MLLI-TR - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and lightweight design, making it a convenient choice for network interfaces.

Surface Mount: YES

The surface mount feature allows for easy and secure installation, making this network interface suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for space-constrained applications where every millimeter counts.

No. of Terminals: 48

With 48 terminals, this network interface offers ample connectivity options, making it versatile for various networking needs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances signal integrity and reduces interference, ensuring reliable and high-performance networking.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this network interface can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Terminal Position: QUAD

The quad terminal position offers increased stability and robustness, making this network interface suitable for demanding networking applications.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm allows for a low-profile design, making this network interface suitable for space-saving solutions.

Width: 7 mm

With a width of 7 mm, this network interface offers a compact footprint, ideal for applications where size matters.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures quick and efficient reflow soldering, making installation fast and convenient.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this network interface is designed to withstand high-temperature reflow soldering processes, ensuring reliability and durability.

Length: 7 mm

The 7 mm length provides a balanced form factor, making this network interface a versatile choice for various networking setups.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation ensures that this network interface can operate reliably in harsh industrial environments with temperature fluctuations.

Terminal Form: GULL WING

The gull wing terminal form offers robust mechanical support, ensuring secure connections and longevity in networking applications.

Telecom IC Type: ETHERNET TRANSCEIVER

The Ethernet transceiver type ensures seamless communication and compatibility with Ethernet networks, making this network interface a reliable choice for networking needs.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this network interface offers compatibility with standard voltage requirements in networking applications, ensuring ease of integration.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and compact placement of terminals, making this network interface suitable for high-density networking setups.

Data Rate: 100 Mbps

With a data rate of 100 Mbps, this network interface offers fast and reliable data transmission, making it suitable for high-performance networking applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this network interface has moderate moisture resistance, ensuring reliable performance in varying environmental conditions.

Technical Specifications

Network Interfaces KSZ8051MLLI-TR attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

KSZ8051MLLI-TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8517.70.00.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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