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DSPIC33FJ64MC804-E/ML

Microchip Technology

DSPIC33FJ64MC804-E/ML by Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 44; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$8.130

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 135 parts In-Stock

1+ parts

$8.130

100+ parts

$6.750

1k+ parts

-

10k+ parts

-

135

$8.130

$6.750

-

-

Microchip Technology

USA . 115 parts In-Stock

1+ parts

$8.130

100+ parts

$6.750

1k+ parts

$6.210

10k+ parts

$5.920

115

$8.130

$6.750

$6.210

$5.920

Mouser Electronics

USA . 35 parts In-Stock

1+ parts

$8.130

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$8.130

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,084 parts In-Stock

1+ parts

-

100+ parts

-

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2,084

-

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,216 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

$1.968

10k+ parts

$1.968

5,216

$2.050

-

$1.968

$1.968

Ampacity Inc.

Singapore . 73 parts In-Stock

1+ parts

$6.910

100+ parts

-

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-

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-

73

$6.910

-

-

-

Corohmni

South Africa . 216 parts In-Stock

1+ parts

$37.710

100+ parts

-

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216

$37.710

-

-

-

LOOK Integrated Logistics

Peru . 7,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,201

-

-

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LMD Electronica

Estonia . 4,842 parts In-Stock

1+ parts

-

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4,842

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Argo Parts USA

USA . 2,015 parts In-Stock

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2,015

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Continental Prestige Electronics

USA . 942 parts In-Stock

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942

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NIA Electronics

USA . 634 parts In-Stock

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634

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Ledger Components

France . 634 parts In-Stock

1+ parts

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634

-

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Montano Global Distributors

Canada . 88 parts In-Stock

1+ parts

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100+ parts

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88

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Netroflash

USA . 50 parts In-Stock

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50

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Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64MC804-E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33FJ64MC804-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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