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DSPIC33FJ64GS406-50I/MR

Microchip Technology

DSPIC33FJ64GS406-50I/MR by Microchip Technology

DSPIC33FJ64GS406-50I/MR by Microchip is a 16-bit DSP with 8192 RAM words, operating at 50 MHz. Ideal for industrial applications, it offers 7 timers, 5 external interrupts, and 4 DMA channels. With low power mode and PWM channels, it's suitable for digital signal processing tasks requiring high-speed performance.

Median Price

$7.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 850 parts In-Stock

1+ parts

$7.110

100+ parts

$5.920

1k+ parts

$5.430

10k+ parts

$5.170

850

$7.110

$5.920

$5.430

$5.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$6.340

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$6.340

-

-

-

NAC Semi

USA . 680 parts In-Stock

1+ parts

$7.400

100+ parts

$6.710

1k+ parts

$6.130

10k+ parts

-

680

$7.400

$6.710

$6.130

-

Vyrian

USA . 6,419 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,419

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 762 parts In-Stock

1+ parts

$6.040

100+ parts

-

1k+ parts

-

10k+ parts

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762

$6.040

-

-

-

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$6.340

100+ parts

$6.023

1k+ parts

$5.722

10k+ parts

$5.643

40

$6.340

$6.023

$5.722

$5.643

Continental Prestige Electronics

USA . 6,275 parts In-Stock

1+ parts

$6.340

100+ parts

-

1k+ parts

-

10k+ parts

$6.213

6,275

$6.340

-

-

$6.213

AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$9.871

100+ parts

-

1k+ parts

-

10k+ parts

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578

$9.871

-

-

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Corohmni

South Africa . 2,906 parts In-Stock

1+ parts

$29.462

100+ parts

-

1k+ parts

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2,906

$29.462

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Montano Global Distributors

Canada . 5,284 parts In-Stock

1+ parts

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5,284

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NIA Electronics

USA . 2,969 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,969

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Ledger Components

France . 2,969 parts In-Stock

1+ parts

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100+ parts

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2,969

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LMD Electronica

Estonia . 2,444 parts In-Stock

1+ parts

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100+ parts

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2,444

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

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Argo Parts USA

USA . 594 parts In-Stock

1+ parts

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594

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LOOK Integrated Logistics

Peru . 84 parts In-Stock

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84

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Overview

Unlock the power of cutting-edge technology with the DSPIC33FJ64GS406-50I/MR by Microchip Technology. As a leading manufacturer in the digital signal processors category, Microchip delivers top-quality products designed to enhance performance across various applications. Experience seamless functionality and reliability with this product, offering customers unmatched value, efficiency, and innovation. Stay ahead of the curve with the DSPIC33FJ64GS406-50I/MR and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can handle a wide range of power inputs, making it versatile in various applications.

On Chip Data RAM Width: 8

Having a data RAM width of 8 ensures efficient data processing and storage capabilities within the chip itself.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability of the product, meeting automotive industry standards.

Bit Size: 16

A 16-bit size allows for higher precision and performance in processing digital signals and data.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common power sources.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfaces and peripherals, allowing for versatile system designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in mounting options and thermal management, catering to different application requirements.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures the product operates reliably even under low power conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand extended use in various environments without overheating.

No. of External Interrupts: 5

Having 5 external interrupts allows for efficient handling of external events and signals, improving real-time responsiveness.

Minimum Operating Temperature: -40 °C

The product can operate in harsh cold conditions down to -40°C, making it suitable for a wide range of temperature environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability, ensuring reliable electrical connections.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, expanding the range of signals that can be processed by the DSP.

Terminal Position: QUAD

Quad terminal position facilitates easy integration and connection within circuit layouts, optimizing space usage.

Maximum Seated Height: 1 mm

With a low seated height of 1mm, the product can be mounted in compact devices without adding bulk.

RAM Words: 8192

The 8192 RAM words provide ample memory storage for data processing, ensuring efficient performance in handling complex algorithms.

Width: 9 mm

A width of 9mm offers a compact form factor, suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capabilities support testing and diagnostics during manufacturing and maintenance, ensuring product reliability.

Maximum Clock Frequency: 50 MHz

Operating at a clock frequency of 50 MHz allows for high-speed data processing and real-time computation capabilities.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, the product can withstand manufacturing processes without degradation.

Peak Reflow Temperature °C: 260

The product can endure peak reflow temperatures up to 260°C during soldering, ensuring reliable solder joints.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architecture enhances data throughput and concurrency, improving overall processing efficiency.

Length: 9 mm

A length of 9mm contributes to the compact size of the product, suitable for applications requiring space-saving designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, the product can operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Featuring digital signal processor functionality along with other peripheral IC types expands the product's versatility in application configurations.

No. of Timers: 7

Offering 7 timers provides precise timing control for various operations and tasks, enhancing system performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes and improves solder joint reliability.

Maximum Supply Current: 170 mA

Operating at a maximum supply current of 170mA allows for efficient power usage, prolonging battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power delivery for optimal performance.

No. of DMA Channels: 4

Featuring 4 DMA channels enables direct memory access for efficient data transfer, reducing processor load and enhancing overall system efficiency.

No. of Serial I/Os: 2

The 2 serial I/Os support communication with external devices, expanding connectivity options for data exchange and control.

PWM Channels: YES

Having PWM channels allows for precise control of analog output signals, enabling applications such as motor speed control and LED brightness adjustment.

ROM Programmability: FLASH

Using flash ROM for programmability offers flexibility in updating firmware and software, adapting to changing application requirements.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides high-density mounting options, accommodating miniaturization trends in electronics design.

Format: FIXED POINT

Operating in a fixed-point format simplifies arithmetic operations and enhances computational efficiency, ideal for real-time signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product's tolerance to moisture exposure during storage and handling, ensuring reliability when subjected to varying environmental conditions.

Speed: 50 rpm

With a speed rating of 50 rpm, the product offers rapid data processing capabilities, suitable for applications requiring high-speed signal analysis.

Low Power Mode: YES

Including a low power mode enhances energy efficiency and extends battery life in power-sensitive applications, conserving power resources.

Barrel Shifter: YES

Having a barrel shifter enables efficient bit manipulation and data rotation operations, enhancing computational performance for digital signal processing tasks.

On Chip Program ROM Width: 24

Having a ROM width of 24 integrated on-chip allows for ample program storage and execution space, supporting complex algorithms and applications.

No. of I/O Lines: 58

Featuring 58 I/O lines provides extensive connectivity options for interfacing with external devices and peripherals, enhancing system integration capabilities.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS406-50I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

58

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Trade Compliance

DSPIC33FJ64GS406-50I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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