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DSPIC33EP512GM706-I/MR

Microchip Technology

DSPIC33EP512GM706-I/MR by Microchip Technology

DSPIC33EP512GM706-I/MR by Microchip Technology is a 16-bit DSP with 49152 RAM words, operating at up to 60 MHz. Ideal for industrial applications, it features 3.3V supply voltage, FLASH ROM programmability, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$7.966

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 120 parts In-Stock

1+ parts

$8.500

100+ parts

$7.060

1k+ parts

-

10k+ parts

-

120

$8.500

$7.060

-

-

Microchip Technology

USA . 37 parts In-Stock

1+ parts

$8.500

100+ parts

$7.060

1k+ parts

$6.490

10k+ parts

$6.180

37

$8.500

$7.060

$6.490

$6.180

Master Electronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$6.080

1k+ parts

$5.900

10k+ parts

-

120

-

$6.080

$5.900

-

Verical

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$7.433

1k+ parts

$7.261

10k+ parts

-

120

-

$7.433

$7.261

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$7.627

100+ parts

-

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-

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15

$7.627

-

-

-

NAC Semi

USA . 37 parts In-Stock

1+ parts

$8.820

100+ parts

$8.000

1k+ parts

$7.320

10k+ parts

-

37

$8.820

$8.000

$7.320

-

Vyrian

USA . 2,293 parts In-Stock

1+ parts

-

100+ parts

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2,293

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Chip Stock

USA . 365 parts In-Stock

1+ parts

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365

-

-

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IBS Electronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$8.527

1k+ parts

$8.275

10k+ parts

-

120

-

$8.527

$8.275

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 46 parts In-Stock

1+ parts

$6.430

100+ parts

-

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-

10k+ parts

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46

$6.430

-

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Continental Prestige Electronics

USA . 5,189 parts In-Stock

1+ parts

$7.627

100+ parts

-

1k+ parts

-

10k+ parts

$7.474

5,189

$7.627

-

-

$7.474

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.627

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$7.627

-

-

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AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$17.867

100+ parts

-

1k+ parts

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533

$17.867

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Aztec Data Supply Inc.

USA . 181 parts In-Stock

1+ parts

$28.080

100+ parts

-

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181

$28.080

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Corohmni

South Africa . 949 parts In-Stock

1+ parts

$37.004

100+ parts

-

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949

$37.004

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Lixinc

USA . 18,058 parts In-Stock

1+ parts

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18,058

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RGB Technical Solutions

Ukraine . 4,296 parts In-Stock

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4,296

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Argo Parts USA

USA . 3,199 parts In-Stock

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3,199

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC33EP512GM706-I/MR. Manufactured by a trusted industry leader, this high-quality DSP offers unparalleled performance and versatility in a wide range of applications. With cutting-edge technology and exceptional reliability, this product provides customers with unmatched value, benefits, and advantages. Experience seamless operation and innovative solutions with the Microchip Technology DSPIC33EP512GM706-I/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it a good choice for portable applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, making it a convenient choice for electronic assemblies.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage range provides flexibility in power supply options, making it suitable for various system designs.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data processing and storage, enhancing the performance of the product.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability in manufacturing, making it a dependable choice for critical applications.

Package Shape: SQUARE

The square package shape optimizes space utilization, making it suitable for compact designs with limited board space.

Bit Size: 16

The 16-bit size offers high processing power and precision, making it ideal for complex signal processing tasks.

Power Supplies (V): 3.3

The standardized power supply voltage of 3.3V ensures compatibility with common power sources, simplifying system integration.

No. of Terminals: 64

The generous number of terminals allows for versatile connectivity options, enabling a wide range of applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in thermal management and form factor, making it adaptable to different design requirements.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GM706-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP512GM706-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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