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DSPIC33CK64MP208-E/PT

Microchip Technology

DSPIC33CK64MP208-E/PT by Microchip Technology

DSPIC33CK64MP208-E/PT by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, 3.6 V max supply voltage, and AEC-Q100 screening for automotive applications. Featuring 8192 RAM words, FLASH ROM programmability, and low power mode, it's ideal for embedded control systems in automotive electronics.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,287 parts In-Stock

1+ parts

$2.720

100+ parts

$2.240

1k+ parts

-

10k+ parts

-

1,287

$2.720

$2.240

-

-

Microchip Technology

USA . 476 parts In-Stock

1+ parts

$2.720

100+ parts

$2.240

1k+ parts

$2.060

10k+ parts

$1.960

476

$2.720

$2.240

$2.060

$1.960

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 238 parts In-Stock

1+ parts

$2.940

100+ parts

$2.650

1k+ parts

$2.390

10k+ parts

-

238

$2.940

$2.650

$2.390

-

Vyrian

USA . 7,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,238

-

-

-

-

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

87

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,033 parts In-Stock

1+ parts

$5.030

100+ parts

-

1k+ parts

-

10k+ parts

-

1,033

$5.030

-

-

-

Corohmni

South Africa . 527 parts In-Stock

1+ parts

$30.404

100+ parts

-

1k+ parts

-

10k+ parts

-

527

$30.404

-

-

-

Fulton Briggs Corp.

USA . 3,127 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,127

-

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

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Overview

Enhance your digital signal processing capabilities with the DSPIC33CK64MP208-E/PT by Microchip Technology. This top-notch product offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications in the digital signal processing category. With advanced features and cutting-edge technology, this DSP provides exceptional value to customers by delivering superior performance, efficiency, and flexibility. Trust Microchip Technology to provide you with innovative solutions that meet your needs and exceed your expectations. Elevate your projects to new heights with the DSPIC33CK64MP208-E/PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile power options in different applications.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width enhances the processing capabilities of the DSP.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures the product meets automotive industry standards for reliability and quality.

Bit Size: 16

The 16-bit size allows for complex calculations and signal processing tasks to be performed efficiently.

No. of Terminals: 80

Having a high number of terminals provides flexibility in connecting external components and peripherals.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in optimizing power consumption and efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes the product suitable for harsh environmental conditions.

No. of External Interrupts: 4

Having multiple external interrupts offers efficient handling of external events and interrupts.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the product suitable for use in cold environments.

Maximum Seated Height: 1.2 mm

The slim profile with a maximum seated height of 1.2 mm enables compact and space-saving designs.

RAM Words: 8192

The high RAM words capacity allows for storage and processing of large amounts of data efficiently.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer speeds and overall system performance.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high-speed operation.

No. of DMA Channels: 4

The presence of multiple DMA channels enables efficient data transfer without CPU intervention.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

As both a DSP and a controller, the product is versatile and can handle a variety of tasks in different applications.

ROM Programmability: FLASH

With Flash ROM programmability, the product can be easily reprogrammed and updated for future enhancements.

Low Power Mode: YES

The availability of a low power mode helps in reducing power consumption during idle or low-load situations.

Barrel Shifter: YES

The presence of a barrel shifter enables efficient shifting and rotation operations in data processing.

On Chip Program ROM Width: 24

The wide on-chip program ROM width of 24 enhances the storage and execution of program instructions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK64MP208-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

42.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

DSPIC33CK64MP208-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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