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DSPIC30F3010-20E/SO

Microchip Technology

DSPIC30F3010-20E/SO by Microchip Technology

DSPIC30F3010-20E/SO by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 125°C. Ideal for automotive applications, it features flash ROM programmability, CMOS technology, and operates on supply voltages of 3/5V.

Median Price

$6.650

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 216 parts In-Stock

1+ parts

$6.650

100+ parts

$5.480

1k+ parts

$5.030

10k+ parts

$4.790

216

$6.650

$5.480

$5.030

$4.790

DigiKey

USA . 187 parts In-Stock

1+ parts

$6.650

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$5.813

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$6.650

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Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$6.650

100+ parts

$6.010

1k+ parts

$5.960

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-

81

$6.650

$6.010

$5.960

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Verical

USA . 13 parts In-Stock

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$13.286

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Distributors (In-Stock)

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Vyrian

USA . 1,916 parts In-Stock

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Electro Sonic

Canada . 135 parts In-Stock

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$6.750

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$5.840

10k+ parts

$5.730

135

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$6.750

$5.840

$5.730

IBS Electronics

USA . 135 parts In-Stock

1+ parts

-

100+ parts

$8.996

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$8.229

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135

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$8.996

$8.229

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Ampacity Inc.

Singapore . 149 parts In-Stock

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$5.070

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149

$5.070

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Lixinc

USA . 5,130 parts In-Stock

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5,130

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RGB Technical Solutions

Ukraine . 948 parts In-Stock

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948

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Netroflash

USA . 500 parts In-Stock

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Infinite Electronics LLP (Excess)

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Perfect Parts

USA . 93 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the DSPIC30F3010-20E/SO by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology has crafted a high-quality Digital Signal Processor that offers unparalleled performance and reliability. Ideal for applications in automotive and industrial settings, this product delivers exceptional value with its advanced features and impressive capabilities. Experience seamless operation and superior results with the DSPIC30F3010-20E/SO, a game-changer in the world of digital signal processors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability, cost-effectiveness, and ease of manufacturing.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, saving space on circuit boards.

Maximum Supply Voltage: 5.5 V

This high voltage allows for compatibility with a wide range of power sources, increasing versatility.

Bit Size: 16

A 16-bit architecture allows for high precision in signal processing applications, resulting in accurate and reliable output.

Power Supplies (V): 3/5

Support for multiple power supply voltages enables flexible integration into different systems with varying power requirements.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and interfaces, enhancing the device's functionality.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption while maintaining optimal performance levels.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold environments, providing durability and resilience.

Maximum Seated Height: 2.65 mm

A compact seated height allows for slim and sleek device designs, perfect for space-constrained applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency enables fast signal processing and data throughput, enhancing the device's performance capabilities.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this DSP meets industry standards for reliability and durability in challenging operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The inclusion of a digital signal processor and controller enhances the device's processing capabilities, allowing for advanced signal manipulation and control functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in noisy environments.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, ensuring flexibility and adaptability in diverse applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F3010-20E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC30F3010-20E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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