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ATSAML10E14A-MU

Microchip Technology

ATSAML10E14A-MU by Microchip Technology

ATSAML10E14A-MU by Microchip: 32-bit Cortex-M23 CPU, 3.63V max supply voltage, 32MHz clock freq. Ideal for industrial applications requiring low power mode, with peripherals like BOD, RTC, and SPI connectivity.

Median Price

$1.282

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 328 parts In-Stock

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$0.384

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DigiKey

USA . 17 parts In-Stock

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$2.180

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Verical

USA . 328 parts In-Stock

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RS (Exports)

UK . 20 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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$1.937

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Vyrian

USA . 5,407 parts In-Stock

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VNN

France . 918 parts In-Stock

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Ampacity Inc.

Singapore . 179 parts In-Stock

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$0.423

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Continental Prestige Electronics

USA . 6,335 parts In-Stock

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$1.937

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$1.898

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Netroflash

USA . 500 parts In-Stock

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$1.937

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$1.840

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$1.801

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$1.937

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$1.801

Argo Parts USA

USA . 442 parts In-Stock

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$1.937

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AZTECH Wire

Italy . 893 parts In-Stock

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$17.928

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Corohmni

South Africa . 863 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,267 parts In-Stock

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Authorized Procurement Solutions

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RGB Technical Solutions

Ukraine . 697 parts In-Stock

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Overview

Unleash the power of innovation with the Microchip Technology ATSAML10E14A-MU microcontroller. Boasting top-notch quality and cutting-edge technology, this chip is a game-changer in the world of microcontrollers. From industrial applications to IoT devices, this powerful Cortex-M23 CPU family microcontroller offers unparalleled performance and reliability. With a wide range of peripherals, low power modes, and advanced features, the ATSAML10E14A-MU provides customers with value, efficiency, and endless possibilities for their projects. Elevate your designs with Microchip Technology's exceptional microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a variety of environments and applications.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency, enhancing the overall performance of the microcontroller.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of devices.

CPU Family: CORTEX-M23

CORTEX-M23 family offers a balance of performance and power efficiency, making it ideal for various embedded applications.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast data processing and real-time responsiveness in the microcontroller.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple analog to digital converters with high resolution allow for precise and accurate conversion of analog signals, suitable for sensor interfacing and data acquisition.

Connectivity: I2C, SPI, USART

Multiple connectivity options like I2C, SPI, and USART facilitate easy communication with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers ATSAML10E14A-MU attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M23

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

8

No. of I/O Lines:

25

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

4096

RAM Words:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

.247 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

I2C, SPI, USART

Peripherals:

BOD, COMPARATOR(4), DMA(8), POR, RTC, TIMER(3), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

ATSAML10E14A-MU Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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