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AT91SAM9M10-CU

Microchip Technology

AT91SAM9M10-CU by Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE;

Median Price

$23.584

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,969 parts In-Stock

1+ parts

-

100+ parts

$20.430

1k+ parts

$18.280

10k+ parts

$17.200

8,969

-

$20.430

$18.280

$17.200

Verical

USA . 8,180 parts In-Stock

1+ parts

-

100+ parts

$26.738

1k+ parts

$24.175

10k+ parts

-

8,180

-

$26.738

$24.175

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 333 parts In-Stock

1+ parts

$21.612

100+ parts

-

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333

$21.612

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-

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Vyrian

USA . 667 parts In-Stock

1+ parts

$22.750

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667

$22.750

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-

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A&K Electronics

USA . 44 parts In-Stock

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44

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Bristol Electronics

USA . 44 parts In-Stock

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44

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Connector Distribution Corp

USA . 4 parts In-Stock

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4

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Right Parts Inc.

USA . 4 parts In-Stock

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4

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Semtec, LLC

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 998 parts In-Stock

1+ parts

$20.475

100+ parts

-

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998

$20.475

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Marpe Global Electronics

Taiwan . 8,076 parts In-Stock

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8,076

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A-Z Elektronik GmbH

Germany . 6,306 parts In-Stock

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6,306

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Alle Elektronik GmbH

Germany . 4,204 parts In-Stock

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4,204

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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XL Components Corporation

Australia . 3,182 parts In-Stock

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Supply Digital

USA . 2,099 parts In-Stock

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2,099

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QualityLine Systems

Poland . 1,654 parts In-Stock

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1,654

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Microchip USA

USA . 206 parts In-Stock

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206

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Technical Specifications

Microprocessors AT91SAM9M10-CU attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

14

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

No. of DMA Channels:

37

No. of External Interrupts:

1

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

65536

Maximum Seated Height:

1.2 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AT91SAM9M10-CU Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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