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AT86RF231-ZUR

Microchip Technology

AT86RF231-ZUR by Microchip Technology

Microchip's AT86RF231-ZUR is a CMOS IC with 32 terminals, operating from -40 to 85°C. It has power supplies of 1.8V and 3V, suitable for industrial applications. The chip carrier package is surface-mountable and made of plastic/epoxy, ideal for telecom interfaces.

Median Price

$4.580

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7 parts In-Stock

1+ parts

$4.220

100+ parts

$3.630

1k+ parts

$3.250

10k+ parts

$3.050

7

$4.220

$3.630

$3.250

$3.050

Mouser Electronics

USA . 3,343 parts In-Stock

1+ parts

$4.580

100+ parts

$4.530

1k+ parts

$4.490

10k+ parts

$3.830

3,343

$4.580

$4.530

$4.490

$3.830

Arrow

USA . 2,913 parts In-Stock

1+ parts

$4.615

100+ parts

$4.402

1k+ parts

$4.188

10k+ parts

-

2,913

$4.615

$4.402

$4.188

-

DigiKey

USA . 6,671 parts In-Stock

1+ parts

$4.700

100+ parts

-

1k+ parts

-

10k+ parts

-

6,671

$4.700

-

-

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Verical

USA . 2,913 parts In-Stock

1+ parts

-

100+ parts

$4.402

1k+ parts

$4.188

10k+ parts

-

2,913

-

$4.402

$4.188

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 222 parts In-Stock

1+ parts

$3.338

100+ parts

-

1k+ parts

-

10k+ parts

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222

$3.338

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.600

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.600

-

-

-

Chip Stock

USA . 31,000 parts In-Stock

1+ parts

-

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31,000

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Vyrian

USA . 5,390 parts In-Stock

1+ parts

-

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1k+ parts

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5,390

-

-

-

-

Semi Source

USA . 4,202 parts In-Stock

1+ parts

-

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4,202

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-

-

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VNN

France . 3,385 parts In-Stock

1+ parts

-

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3,385

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-

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Rebound Electronics

UK . 1,844 parts In-Stock

1+ parts

-

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1,844

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Elcom Components

USA . 1 parts In-Stock

1+ parts

-

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1

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 847 parts In-Stock

1+ parts

$3.163

100+ parts

-

1k+ parts

-

10k+ parts

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847

$3.163

-

-

-

Ampacity Inc.

Singapore . 7,436 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

-

10k+ parts

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7,436

$3.590

-

-

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Continental Prestige Electronics

USA . 2,165 parts In-Stock

1+ parts

$4.600

100+ parts

-

1k+ parts

-

10k+ parts

$4.508

2,165

$4.600

-

-

$4.508

Lixinc

USA . 15,972 parts In-Stock

1+ parts

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15,972

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Perfect Parts

USA . 11,388 parts In-Stock

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11,388

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Glotronic Ltd.

UK . 3,500 parts In-Stock

1+ parts

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3,500

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Fulton Briggs Corp.

USA . 3,493 parts In-Stock

1+ parts

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1k+ parts

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3,493

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-

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Supply Digital

USA . 2,760 parts In-Stock

1+ parts

-

100+ parts

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2,760

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Argo Parts USA

USA . 1,733 parts In-Stock

1+ parts

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100+ parts

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1,733

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Overview

Experience superior performance and reliability with the AT86RF231-ZUR by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality products that are trusted by professionals worldwide. The AT86RF231-ZUR falls under the category of Other Function Telecom Interface ICs, offering versatile applications and unparalleled functionality. With its advanced features and robust design, this product ensures seamless operation and optimal efficiency for all your telecom interface needs. Upgrade your systems today and unlock the countless benefits and advantages that the AT86RF231-ZUR has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling automated manufacturing processes.

Package Shape: SQUARE

The square package shape provides a stable and compact form factor, making it suitable for tight layout designs.

Power Supplies (V): 1.8,3

The ability to operate on multiple power supply voltages (1.8V and 3V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 32

Having 32 terminals allows for the product to interface with a variety of external components, expanding its functionality and connectivity options.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enables efficient heat dissipation and protection of the integrated circuits, ensuring reliable performance under various operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes this product suitable for industrial applications where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold environments, adding to its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections in diverse operating conditions.

Terminal Position: QUAD

The quad terminal position allows for efficient and organized connection to other components, simplifying installation and maintenance processes.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades indicates that this product can perform reliably in demanding industrial environments with varying temperature conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and provides better thermal performance, enhancing overall product reliability and longevity.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for closer spacing of terminals, enabling higher component density on circuit boards and compact overall system design.

Technical Specifications

Other Function Telecom Interface ICs AT86RF231-ZUR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8,3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

AT86RF231-ZUR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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