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AR1021T-I/SS

Microchip Technology

AR1021T-I/SS by Microchip Technology

Microchip AR1021T-I/SS is a 20-terminal IC with operating temp range -40 to 85°C. It features small outline package, matte tin finish, and industrial temperature grade suitable for analog circuit applications. Package dimensions are 7.2mm x 5.3mm with terminal pitch of 0.65mm, making it ideal for surface mount designs.

Median Price

$2.224

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 165 parts In-Stock

1+ parts

$2.250

100+ parts

$1.950

1k+ parts

-

10k+ parts

-

165

$2.250

$1.950

-

-

DigiKey

USA . 2,524 parts In-Stock

1+ parts

$2.450

100+ parts

$2.163

1k+ parts

-

10k+ parts

$2.163

2,524

$2.450

$2.163

-

$2.163

Microchip Technology

USA . 13 parts In-Stock

1+ parts

$2.450

100+ parts

$2.050

1k+ parts

$1.870

10k+ parts

$1.760

13

$2.450

$2.050

$1.870

$1.760

Arrow

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.198

3,200

-

-

-

$2.198

Verical

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.198

3,200

-

-

-

$2.198

Master Electronics

USA . 2,950 parts In-Stock

1+ parts

-

100+ parts

$2.150

1k+ parts

$2.100

10k+ parts

$2.060

2,950

-

$2.150

$2.100

$2.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 9,215 parts In-Stock

1+ parts

$2.132

100+ parts

$1.965

1k+ parts

-

10k+ parts

$1.965

9,215

$2.132

$1.965

-

$1.965

Chip Stock

USA . 31,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

31,900

-

-

-

-

IBS Electronics

USA . 2,950 parts In-Stock

1+ parts

-

100+ parts

$3.015

1k+ parts

$2.945

10k+ parts

$2.889

2,950

-

$3.015

$2.945

$2.889

ComSIT Distribution GmbH

Germany . 1,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,818

-

-

-

-

VNN

France . 1,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,117

-

-

-

-

Sensible Micro Corp

USA . 1,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

-

-

-

-

Nova Conductors

Japan . 97 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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97

-

-

-

-

Bristol Electronics

USA . 52 parts In-Stock

1+ parts

-

100+ parts

$1.680

1k+ parts

-

10k+ parts

-

52

-

$1.680

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,331 parts In-Stock

1+ parts

$1.620

100+ parts

-

1k+ parts

-

10k+ parts

-

3,331

$1.620

-

-

-

Vigor

Singapore . 8,170 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

8,170

$1.980

-

-

-

S.R.D Solutions

India . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,000

-

-

-

-

Lixinc

USA . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,062

-

-

-

-

RGB Technical Solutions

Ukraine . 3,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,681

-

-

-

-

Futuretech Components

Singapore . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

-

-

-

-

GreenTree Electronics

Israel . 1,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,095

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience the cutting-edge technology of the AR1021T-I/SS by Microchip Technology, a leading manufacturer in the semiconductor industry. This small outline, shrink pitch IC offers unparalleled quality and reliability for various analog circuit applications. With a wide operating temperature range and dual terminal position, this innovative product provides exceptional value and performance. Trust Microchip Technology to deliver top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and can withstand harsh environmental conditions, making the product reliable for extended use.

Surface Mount: YES

Surface mount technology allows for compact design and makes the product suitable for automated assembly processes.

Screening Level: TS 16949

TS 16949 screening level ensures high-quality standards and reliability in the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape offers ease of handling and integration into various electronic devices.

No. of Terminals: 20

Having 20 terminals provides flexibility for connecting the product to other components in a circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the circuit board and allows for higher density designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can handle a wide range of operating conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at temperatures as low as -40°C ensures the product's reliability in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good solderability and resistance to corrosion, enhancing the product's longevity.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and easier connection in the circuit.

Maximum Seated Height: 2 mm

Low seated height of 2mm enables the product to be used in slim-profile applications.

Width (mm): 5.3 mm

Narrow width of 5.3mm contributes to a compact form factor and facilitates space-saving integration.

Other IC type: ANALOG CIRCUIT

Analog circuit type offers precise signal processing capabilities, making the product suitable for a wide range of applications.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement allows the product to operate efficiently even in low power scenarios.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures optimal soldering conditions and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and long-term stability of the product.

Length: 7.2 mm

Compact length of 7.2mm allows for space-efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate reliably in demanding industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for high-density mounting and efficient use of board space.

Moisture Sensitivity Level (MSL): 2

MSL level 2 means the product is resistant to moisture-related issues during storage and operation.

Maximum Supply Voltage (Vsup): 5.25 V

High maximum supply voltage of 5.25V ensures compatibility with a wide range of power sources and operating conditions.

Technical Specifications

Other Function Semiconductors AR1021T-I/SS attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5.3 mm

Trade Compliance

AR1021T-I/SS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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