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AR1021T-I/ML

Microchip Technology

AR1021T-I/ML by Microchip Technology

Microchip Technology's AR1021T-I/ML is a 20-terminal chip carrier with matte tin finish. Operating b/w -40 to 85°C, it supports supply voltage from 2.5V to 5.25V for industrial applications. This analog circuit IC in a square package is ideal for surface mount setups requiring very thin profile components.

Median Price

$1.922

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,300 parts In-Stock

1+ parts

$1.225

100+ parts

$1.169

1k+ parts

$1.113

10k+ parts

$1.095

3,300

$1.225

$1.169

$1.113

$1.095

Mouser Electronics

USA . 1,380 parts In-Stock

1+ parts

$2.620

100+ parts

$2.450

1k+ parts

-

10k+ parts

-

1,380

$2.620

$2.450

-

-

DigiKey

USA . 4,806 parts In-Stock

1+ parts

$2.790

100+ parts

$2.450

1k+ parts

-

10k+ parts

$2.450

4,806

$2.790

$2.450

-

$2.450

Verical

USA . 3,300 parts In-Stock

1+ parts

-

100+ parts

$1.169

1k+ parts

$1.113

10k+ parts

$1.095

3,300

-

$1.169

$1.113

$1.095

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Sensible Micro Corp

USA . 9,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,533

-

-

-

-

Chip Stock

USA . 7,703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,703

-

-

-

-

ComSIT Distribution GmbH

Germany . 7,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,150

-

-

-

-

Resion

USA . 2,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

-

-

-

-

VNN

France . 625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

625

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 392 parts In-Stock

1+ parts

$15.703

100+ parts

-

1k+ parts

-

10k+ parts

-

392

$15.703

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$25.231

100+ parts

$22.960

1k+ parts

$20.689

10k+ parts

-

3,000

$25.231

$22.960

$20.689

-

Fulton Briggs Corp.

USA . 1,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,405

-

-

-

-

Argo Parts USA

USA . 1,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Continental Prestige Electronics

USA . 583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

583

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Microchip Technology with the AR1021T-I/ML. This cutting-edge semiconductor offers a wide range of applications in various industries, thanks to its innovative design and superior performance. With a temperature grade suitable for industrial settings and a wide operating temperature range, this product ensures optimal functionality even in challenging environments. Trust Microchip Technology for top-notch solutions that deliver exceptional value and benefits to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost, making the product suitable for various applications.

Surface Mount: YES

Ease of installation on PCBs and potential for automation in manufacturing processes.

Screening Level: TS 16949

High-quality assurance and compliance with automotive industry standards.

Package Shape: SQUARE

Efficient use of space on the PCB and potentially better heat dissipation due to uniform shape.

No. of Terminals: 20

Provides flexibility in connectivity options and potential for multiple functions within a single package.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the product suitable for harsh environments.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance for reliable connections.

Terminal Position: QUAD

Facilitates easy identification and installation of the component on the PCB.

Maximum Seated Height: 1 mm

Low profile design for compact and space-constrained applications.

Width (mm): 4 mm

Compact form factor for efficient use of PCB space.

Other IC type: ANALOG CIRCUIT

Provides analog signal processing capabilities, suitable for a wide range of applications.

Minimum Supply Voltage (Vsup): 2.5 V

Ability to operate at lower voltages for energy-efficient applications.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during manufacturing for reliable solder joints.

Length: 4 mm

Compact size for space-constrained designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

Terminal Form: NO LEAD

Environmentally friendly option that complies with RoHS regulations.

Terminal Pitch: 0.5 mm

Fine pitch for increased density of connections on the PCB.

Maximum Supply Voltage (Vsup): 5.25 V

Can handle higher voltage levels, providing flexibility in power supply options.

Technical Specifications

Other Function Semiconductors AR1021T-I/ML attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

AR1021T-I/ML Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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