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AR1010T-I/SS

Microchip Technology

AR1010T-I/SS by Microchip Technology

Microchip Technology's AR1010T-I/SS is a small outline, shrink pitch IC with 20 terminals. It operates b/w -40 to 125°C and has a peak reflow temperature of 260°C. Ideal for automotive applications due to its moisture sensitivity level of 2 and gull wing terminal form.

Median Price

$3.075

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$3.075

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500

$3.075

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Vyrian

USA . 5,664 parts In-Stock

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5,664

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VNN

France . 90 parts In-Stock

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90

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LIBRA Elektronik GmbH

Germany . 44 parts In-Stock

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44

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Distributors (Availability)

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Corohmni

South Africa . 263 parts In-Stock

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$1.780

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263

$1.780

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Vigor

Singapore . 2,090 parts In-Stock

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$1.820

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2,090

$1.820

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Continental Prestige Electronics

USA . 1,826 parts In-Stock

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$3.075

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$3.014

1,826

$3.075

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$3.014

Argo Parts USA

USA . 368 parts In-Stock

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$3.075

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368

$3.075

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Semicontronic

India . 545 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

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$5.335

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545

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 333 parts In-Stock

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$7.500

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333

$7.500

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Aztec Data Supply Inc.

USA . 4,128 parts In-Stock

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$11.440

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4,128

$11.440

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AZTECH Wire

Italy . 546 parts In-Stock

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$19.865

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546

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Lixinc

USA . 8,234 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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West Coast Incorporated

USA . 101 parts In-Stock

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Overview

Enhance your automotive electronics with the AR1010T-I/SS from Microchip Technology. Designed with top-quality materials and advanced technology, this small outline semiconductor offers exceptional performance and reliability. Perfect for a variety of applications in the automotive industry, the AR1010T-I/SS provides customers with superior functionality and efficiency. Embrace innovation and elevate your projects with this cutting-edge analog circuit IC, delivering value and peace of mind with every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, making it a reliable choice.

Surface Mount: YES

Being surface mount compatible allows for easy installation and integration into circuit boards.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, saving space in electronic applications.

No. of Terminals: 20

With a high number of terminals, this semiconductor can connect to multiple components, increasing versatility.

Package Style: SMALL OUTLINE, SHRINK PITCH

This style offers a streamlined design and efficient performance in various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability and conductivity for optimal performance.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design and connectivity options.

Maximum Seated Height: 2 mm

The low height profile enables the semiconductor to be used in compact devices without sacrificing performance.

Width: 5.3 mm

The narrow width of the semiconductor allows for seamless integration in tight spaces.

Other IC type: ANALOG CIRCUIT

This semiconductor is designed for analog circuits, providing precise signal processing and control.

Maximum Time At Peak Reflow Temperature: 40s

The semiconductor can withstand peak reflow temperatures for extended periods, ensuring reliable soldering.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance allows for efficient soldering and long-term durability.

Length: 7.2 mm

The length of the semiconductor is optimized for compatibility with various electronic devices and applications.

Temperature Grade: AUTOMOTIVE

This semiconductor is designed for automotive use, meeting strict requirements for reliability and performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment and easy installation on circuit boards.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for precise connections and compact layouts in electronic designs.

Moisture Sensitivity Level (MSL): 2

With an MSL level of 2, this semiconductor can withstand moderate moisture exposure during storage and operation.

Technical Specifications

Other Function Semiconductors AR1010T-I/SS attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5.3 mm

Trade Compliance

AR1010T-I/SS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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