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APA600-FG676I

Microchip Technology

APA600-FG676I by Microchip Technology

Microchip Technology's APA600-FG676I is a CMOS FPGA with 21504 logic cells and 600000 equivalent gates. It operates at max 2.7V, has 454 inputs/outputs, and supports a clock frequency of up to 180MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$1,085.830

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 13 parts In-Stock

1+ parts

$1,085.830

100+ parts

$1,074.970

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$1,085.830

$1,074.970

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Verical

USA . 13 parts In-Stock

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$1,085.830

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$1,074.970

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13

$1,085.830

$1,074.970

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Microchip Technology

USA . 16 parts In-Stock

1+ parts

$1,123.730

100+ parts

$1,108.340

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$642.130

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16

$1,123.730

$1,108.340

$642.130

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Distributors (In-Stock)

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Nova Conductors

Japan . 48 parts In-Stock

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$1,005.960

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48

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Vyrian

USA . 6,236 parts In-Stock

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VNN

France . 1,000 parts In-Stock

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Chip Stock

USA . 507 parts In-Stock

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507

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Digiode

USA . 442 parts In-Stock

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Sensible Micro Corp

USA . 20 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 1 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 275 parts In-Stock

1+ parts

$12.000

100+ parts

$11.700

1k+ parts

$11.640

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275

$12.000

$11.700

$11.640

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Ampacity Inc.

Singapore . 1,592 parts In-Stock

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$17.000

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$17.000

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AZTECH Wire

Italy . 329 parts In-Stock

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$17.722

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$17.722

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Aztec Data Supply Inc.

USA . 4,671 parts In-Stock

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$40.957

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$40.957

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Vigor

Singapore . 2,322 parts In-Stock

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$846.030

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$846.030

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Corohmni

South Africa . 176 parts In-Stock

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$996.935

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Continental Prestige Electronics

USA . 5,002 parts In-Stock

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$1,005.960

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$985.841

5,002

$1,005.960

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Argo Parts USA

USA . 2,283 parts In-Stock

1+ parts

$1,005.960

100+ parts

$995.900

1k+ parts

$985.841

10k+ parts

$975.781

2,283

$1,005.960

$995.900

$985.841

$975.781

Netroflash

USA . 500 parts In-Stock

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$1,005.960

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500

$1,005.960

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Microchip USA

USA . 1,578 parts In-Stock

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$1,124.237

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Fulton Briggs Corp.

USA . 5,405 parts In-Stock

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5,405

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 286 parts In-Stock

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286

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Overview

Elevate your projects with the Microchip Technology APA600-FG676I, a top-of-the-line FPGA that boasts 600,000 equivalent gates and 21,504 logic cells. Harnessing cutting-edge CMOS technology, this programmable IC is a game-changer for applications requiring high-speed data processing and complex algorithms. With its advanced features and reliable performance, this FPGA offers unmatched value and versatility. Whether you're designing advanced electronics or pushing the boundaries of innovation, the APA600-FG676I is the ultimate tool for realizing your vision. Experience the future of technology with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, making it easy to handle and transport.

No. of Logic Cells: 21504

With a large number of logic cells, this FPGA can handle complex and advanced processing tasks effectively.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 2.7 V

The maximum supply voltage of 2.7 V ensures compatibility with a wide range of power sources, making it versatile for different applications.

Technology Used: CMOS

The CMOS technology used in this FPGA offers low power consumption and high noise immunity, making it efficient for various electronic devices.

No. of Inputs: 454

With a high number of inputs, this FPGA can accommodate a large amount of data inputs, enabling it to handle complex tasks effectively.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, maximizing component placement flexibility.

Form Of Terminal: BALL

The ball form of terminals offers good electrical conductivity and reliability, ensuring stable connections in the FPGA circuit.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5 V ensures consistent and reliable operation of the FPGA in various voltage conditions.

Packing Method: TRAY

The tray packing method ensures safe storage and transportation of the FPGAs, reducing the risk of damage during handling and shipping.

Power Supplies (V): 2.5,2.5/3.3

The availability of multiple power supply options allows for flexibility in powering the FPGA, catering to different voltage requirements in various applications.

No. of Terminals: 676

With a high number of terminals, this FPGA offers versatile connectivity options for interfacing with other components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for customization and reconfiguration of logic functions, providing flexibility in adapting to different processing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and electrical performance, contributing to the reliability and stability of the FPGA.

Minimum Supply Voltage: 2.3 V

The minimum supply voltage of 2.3 V ensures compatibility with lower voltage sources, offering flexibility in different power supply scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand elevated temperatures, making it suitable for industrial applications with harsh environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for compact and efficient routing of connections, saving space on circuit boards and reducing signal interference.

Organization: 600000 GATES

The FPGA with 600,000 gates provides extensive logic and processing capabilities, enabling it to handle complex algorithms and computations efficiently.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can function reliably in cold environments, making it suitable for a wide range of operating conditions.

Finishing Of Terminal Used: TIN LEAD

The use of tin lead finishing on terminals ensures good solderability and reliability in the connections, contributing to the overall performance and longevity of the FPGA.

Position Of Terminal: BOTTOM

Having terminals at the bottom of the FPGA allows for easier accessibility and connectivity in circuit board layouts, simplifying the assembly process.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the FPGA is moderately sensitive to moisture, requiring proper handling and storage to prevent damage from humidity.

Maximum Seated Height: 2.44 mm

With a low maximum seated height, this FPGA can be installed in compact devices or systems with limited vertical space, maximizing design flexibility.

Width: 27 mm

The width of 27 mm provides a compact form factor for the FPGA, allowing for efficient integration into circuit board layouts with space constraints.

Maximum Clock Frequency: 180 MHz

With a high maximum clock frequency of 180 MHz, this FPGA can handle high-speed operations and data processing tasks, making it suitable for demanding applications.

No. of Outputs: 454

Having a high number of outputs allows the FPGA to drive multiple external devices or components, enabling versatile signal routing and control capabilities.

Length: 27 mm

The length of 27 mm provides a balanced form factor for the FPGA, offering a combination of compact size and adequate space for terminal connections and circuitry.

Grading Of Temperature: INDUSTRIAL

With an industrial temperature grading, this FPGA is designed to withstand extended temperature ranges, ensuring reliable operation in harsh industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA600-FG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

21504

No. of Inputs:

454

No. of Outputs:

454

No. of Equivalent Gates:

600000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

APA600-FG676I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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