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APA600-FGG484I

Microchip Technology

APA600-FGG484I by Microchip Technology

Microchip Technology's APA600-FGG484I is a CMOS FPGA with 21504 logic cells and 600000 equivalent gates. It operates at a max frequency of 180 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and square shape, it offers 370 inputs/outputs in a compact design.

Median Price

$892.554

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

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$892.554

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VNN

France . 3,337 parts In-Stock

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Vyrian

USA . 619 parts In-Stock

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Chip Stock

USA . 174 parts In-Stock

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Digiode

USA . 87 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 273 parts In-Stock

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$19.636

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Semicontronic

India . 139 parts In-Stock

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$20.000

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$19.500

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$19.400

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$19.400

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Ampacity Inc.

Singapore . 638 parts In-Stock

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$24.000

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Aztec Data Supply Inc.

USA . 2,506 parts In-Stock

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$177.410

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Corohmni

South Africa . 898 parts In-Stock

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$886.387

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Continental Prestige Electronics

USA . 6,127 parts In-Stock

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$892.554

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$874.703

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Netroflash

USA . 2,000 parts In-Stock

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$892.554

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$847.926

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$830.075

2,000

$892.554

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$847.926

$830.075

Argo Parts USA

USA . 1,392 parts In-Stock

1+ parts

$892.554

100+ parts

$883.628

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$874.703

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$865.777

1,392

$892.554

$883.628

$874.703

$865.777

Microchip USA

USA . 1,214 parts In-Stock

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$1,001.765

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NIA Electronics

USA . 6,429 parts In-Stock

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Vigor

Singapore . 6,210 parts In-Stock

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LMD Electronica

Estonia . 5,425 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,144 parts In-Stock

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Montano Global Distributors

Canada . 4,853 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,429 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Ledger Components

France . 1,326 parts In-Stock

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LOOK Integrated Logistics

Peru . 907 parts In-Stock

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Corphita

USA . 116 parts In-Stock

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Overview

Unlock limitless possibilities with the APA600-FGG484I by Microchip Technology. This high-quality Field Programmable Gate Array (FPGA) offers unparalleled flexibility and performance for a wide range of applications. With 600,000 equivalent gates and 21,504 logic cells, this FPGA is a powerhouse in a compact package. Whether you're designing cutting-edge electronics or pushing the boundaries of innovation, the APA600-FGG484I delivers the value, reliability, and advantages you need to succeed. Embrace the future of technology with Microchip Technology's APA600-FGG484I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand harsh environmental conditions.

No. of Logic Cells: 21504

High number of logic cells allows for complex and efficient programming.

Maximum Supply Voltage: 2.7 V

Suitable for low power applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 370

Sufficient number of inputs for versatile connectivity.

No. of Equivalent Gates: 600000

Large number of equivalent gates for processing complex logic.

Nominal Supply Voltage (V): 2.5

Stable supply voltage for reliable operation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for versatility in usage environments.

Maximum Clock Frequency: 180 MHz

High clock frequency for fast processing speeds.

Technical Specifications

Field Programmable Gate Arrays (FPGA) APA600-FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

21504

No. of Inputs:

370

No. of Outputs:

370

No. of Equivalent Gates:

600000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

25 mm

Width:

25 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

APA600-FGG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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