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APA150-PQG208

Microchip Technology

APA150-PQG208 by Microchip Technology

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

Median Price

$225.920

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 25 parts In-Stock

1+ parts

$118.880

100+ parts

-

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25

$118.880

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Master Electronics

USA . 66 parts In-Stock

1+ parts

$225.920

100+ parts

$106.250

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66

$225.920

$106.250

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Verical

USA . 66 parts In-Stock

1+ parts

$293.696

100+ parts

$138.125

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66

$293.696

$138.125

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 457 parts In-Stock

1+ parts

$111.929

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457

$111.929

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Vyrian

USA . 286 parts In-Stock

1+ parts

$117.820

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286

$117.820

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IBS Electronics

USA . 144 parts In-Stock

1+ parts

$164.948

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$159.950

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144

$164.948

$159.950

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A&K Electronics

USA . 2 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Semicontronic

India . 55 parts In-Stock

1+ parts

$101.050

100+ parts

$98.524

1k+ parts

$98.018

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55

$101.050

$98.524

$98.018

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Corphita

USA . 248 parts In-Stock

1+ parts

$106.038

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248

$106.038

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Microchip USA

USA . 1,557 parts In-Stock

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$119.380

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1,557

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West Coast Incorporated

USA . 4,095 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Perfect Parts

USA . 1,720 parts In-Stock

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1,720

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Futuretech Components

Singapore . 762 parts In-Stock

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762

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Kepictronics

USA . 200 parts In-Stock

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200

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Technical Specifications

Field Programmable Gate Arrays (FPGA) APA150-PQG208 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

6144

No. of Inputs:

158

No. of Outputs:

158

No. of Equivalent Gates:

150000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

150000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Packing Method:

Tray

Package Equivalence Code:

QFP208,1.2SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

APA150-PQG208 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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