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25LC160C-I/ST

Microchip Technology

25LC160C-I/ST by Microchip Technology

25LC160C-I/ST by Microchip Technology is a SPI EEPROM with 2Kx8 organization, 16384-bit memory density, and 1M write/erase cycles endurance. Operating at -40 to 85°C, it's ideal for industrial applications requiring reliable non-volatile data storage in a compact 0.65mm pitch package.

Median Price

$0.665

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 674 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

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10k+ parts

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674

$0.770

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Arrow

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$0.665

1k+ parts

$0.658

10k+ parts

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200

-

$0.665

$0.658

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Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$0.658

1k+ parts

-

10k+ parts

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200

-

$0.658

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,648 parts In-Stock

1+ parts

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8,648

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VNN

France . 949 parts In-Stock

1+ parts

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949

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$3.435

100+ parts

$3.126

1k+ parts

$2.817

10k+ parts

-

350

$3.435

$3.126

$2.817

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XL Components Corporation

Australia . 6,929 parts In-Stock

1+ parts

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100+ parts

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6,929

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QualityLine Systems

Poland . 2,730 parts In-Stock

1+ parts

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2,730

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Marpe Global Electronics

Taiwan . 2,302 parts In-Stock

1+ parts

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2,302

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Unlock endless possibilities with the 25LC160C-I/ST by Microchip Technology, a top-notch EEPROM that guarantees reliability and superior performance. Crafted by a trusted industry leader, this versatile memory device is perfect for a wide range of applications. With its high-end features and durable construction, this EEPROM ensures seamless operation and data protection. Experience the value and benefits of this cutting-edge product, tailored to meet your specific needs and exceed your expectations. Elevate your projects with the quality and innovation of Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making the EEPROM reliable for long-term use.

Memory IC Type: EEPROM

Being an EEPROM (Electrically Erasable Programmable Read-Only Memory) ensures that data can be easily read, written, and erased electronically, providing flexibility and convenience.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can withstand heat and perform reliably in various environmental conditions.

Endurance: 1000000 Write/Erase Cycles

With a high endurance level, this EEPROM can handle frequent write and erase cycles without compromising its performance or longevity.

Serial Bus Type: SPI

The SPI (Serial Peripheral Interface) bus type allows for high-speed communication between the EEPROM and other devices, enhancing overall system performance.

Technical Specifications

EEPROM 25LC160C-I/ST attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

25LC160C-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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