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25LC128-I/SM

Microchip Technology

25LC128-I/SM by Microchip Technology

25LC128-I/SM by Microchip Tech is a 16KX8 EEPROM with SPI interface. Operates at 5V, 10MHz clock freq, and withstands -40 to 85°C temp range. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$1.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 6,570 parts In-Stock

1+ parts

$1.140

100+ parts

$1.060

1k+ parts

$1.010

10k+ parts

$0.960

6,570

$1.140

$1.060

$1.010

$0.960

DigiKey

USA . 213 parts In-Stock

1+ parts

$1.190

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-

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213

$1.190

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Mouser Electronics

USA . 55 parts In-Stock

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$1.210

100+ parts

$1.180

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55

$1.210

$1.180

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Distributors (In-Stock)

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Vyrian

USA . 7,893 parts In-Stock

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7,893

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VNN

France . 887 parts In-Stock

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887

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,244 parts In-Stock

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$2.110

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Corohmni

South Africa . 237 parts In-Stock

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$3.101

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237

$3.101

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Microchip USA

USA . 2,532 parts In-Stock

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$7.410

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2,532

$7.410

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Continental Prestige Electronics

USA . 3,528 parts In-Stock

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Perfect Parts

USA . 1,509 parts In-Stock

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Marpe Global Electronics

Taiwan . 892 parts In-Stock

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QualityLine Systems

Poland . 892 parts In-Stock

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XL Components Corporation

Australia . 892 parts In-Stock

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Argo Parts USA

USA . 786 parts In-Stock

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786

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Netroflash

USA . 500 parts In-Stock

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Overview

Unlock the power of reliable data storage with the Microchip Technology 25LC128-I/SM EEPROM. Built to withstand industrial environments, this high-quality memory IC offers 16KX8 organization and 1000000 write/erase cycles for long-lasting performance. With a compact small outline package and easy installation, this EEPROM is perfect for applications that require secure and efficient data storage. Trust Microchip Technology for top-notch products that deliver value and peace of mind to customers in need of dependable memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance.

Operating Mode: SYNCHRONOUS

Enhances data transfer speed and efficiency.

Nominal Supply Voltage / Vsup (V): 5

Provides stable power supply for optimal performance.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving installation.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions.

Maximum Clock Frequency (fCLK): 10 MHz

Supports high-speed data processing.

Write Protection: HARDWARE/SOFTWARE

Enhances data security and prevents accidental data loss or corruption.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures reliable data storage and longevity of the EEPROM.

Technical Specifications

EEPROM 25LC128-I/SM attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25LC128-I/SM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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