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24LC128T-I/SMG

Microchip Technology

24LC128T-I/SMG by Microchip Technology

24LC128T-I/SMG by Microchip Technology is a 16KX8 EEPROM with I2C control byte. Operating at 4.5V, it offers 1000000 write/erase cycles and -40 to 85°C temperature range. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$1.066

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.066

100+ parts

-

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10

$1.066

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VNN

France . 13,568 parts In-Stock

1+ parts

-

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13,568

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Vyrian

USA . 3,020 parts In-Stock

1+ parts

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3,020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,218 parts In-Stock

1+ parts

$1.066

100+ parts

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3,218

$1.066

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Continental Prestige Electronics

USA . 878 parts In-Stock

1+ parts

$1.066

100+ parts

-

1k+ parts

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10k+ parts

$1.044

878

$1.066

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-

$1.044

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.066

100+ parts

$1.044

1k+ parts

-

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500

$1.066

$1.044

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Ampacity Inc.

Singapore . 1,184 parts In-Stock

1+ parts

$1.410

100+ parts

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1,184

$1.410

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Corohmni

South Africa . 375 parts In-Stock

1+ parts

$4.684

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375

$4.684

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Microchip USA

USA . 4,664 parts In-Stock

1+ parts

$4.755

100+ parts

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4,664

$4.755

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Aztec Data Supply Inc.

USA . 2,958 parts In-Stock

1+ parts

$5.720

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2,958

$5.720

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$16.670

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644

$16.670

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RGB Technical Solutions

Ukraine . 830 parts In-Stock

1+ parts

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830

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Overview

Unlock the power of reliable data storage with the 24LC128T-I/SMG by Microchip Technology. This top-of-the-line EEPROM offers unparalleled quality and versatility, making it perfect for a wide range of applications. With a focus on value and performance, this product provides customers with the peace of mind that their data is secure and easily accessible. Trust in Microchip Technology to deliver cutting-edge solutions that meet your needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Easy to install on a circuit board, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without issues.

Endurance: 1000000 Write/Erase Cycles

Can withstand a large number of write/erase cycles, ensuring longevity and reliability.

Memory Density: 131072 bit

High memory density for storing a large amount of data.

Serial Bus Type: I2C

Efficient serial communication for data transfer.

Technical Specifications

EEPROM 24LC128T-I/SMG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

4.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC128T-I/SMG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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