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24C02C-I/ST

Microchip Technology

24C02C-I/ST by Microchip Technology

24C02C-I/ST by Microchip Tech is an EEPROM with 256x8 organization, I2C control byte 1010DDDR, and 2048-bit memory density. Operating at -40 to 85°C, it offers 1M write/erase cycles for industrial applications. With a max clock frequency of 0.4 MHz and 0.65mm terminal pitch, it's ideal for systems requiring reliable non-volatile memory storage.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 23,000 parts In-Stock

1+ parts

$0.410

100+ parts

$0.370

1k+ parts

$0.350

10k+ parts

$0.340

23,000

$0.410

$0.370

$0.350

$0.340

Mouser Electronics

USA . 1,125 parts In-Stock

1+ parts

$0.440

100+ parts

$0.394

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-

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1,125

$0.440

$0.394

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Avnet

USA . 600 parts In-Stock

1+ parts

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600

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Verical

USA . 179 parts In-Stock

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100+ parts

$0.818

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179

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$0.818

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Distributors (In-Stock)

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TME

Poland . 123 parts In-Stock

1+ parts

-

100+ parts

$0.602

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123

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$0.602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Montano Global Distributors

Canada . 7,405 parts In-Stock

1+ parts

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7,405

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NIA Electronics

USA . 3,118 parts In-Stock

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3,118

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LMD Electronica

Estonia . 2,059 parts In-Stock

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2,059

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LOOK Integrated Logistics

Peru . 1,980 parts In-Stock

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1,980

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Perfect Parts

USA . 1,449 parts In-Stock

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1,449

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Ledger Components

France . 255 parts In-Stock

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iodParts Technologies Inc.

India . 120 parts In-Stock

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120

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Overview

Unlock endless possibilities with the 24C02C-I/ST EEPROM by Microchip Technology. Offering unparalleled quality and reliability, this versatile memory storage device is ideal for a wide range of applications. From consumer electronics to automotive systems, this product ensures seamless operation and data retention. With its durable construction and advanced features, the 24C02C-I/ST provides exceptional value and performance. Experience the advantages of Microchip Technology's innovative solutions and elevate your projects to new heights. Choose the 24C02C-I/ST for superior functionality and unmatched convenience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various environments.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated data transfer within the EEPROM.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage makes integration with other components straightforward.

No. of Terminals: 8

A moderate number of terminals facilitates connectivity and communication with external devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this EEPROM can function reliably in demanding conditions.

Memory Density: 2048 bit

Provides ample storage capacity for data while maintaining efficient operation.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures longevity and reliability for frequent read/write operations.

Serial Bus Type: I2C

The I2C bus protocol allows for easy interfacing and communication with other devices in a system.

Technical Specifications

EEPROM 24C02C-I/ST attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

1 ms

Write Protection:

HARDWARE

Trade Compliance

24C02C-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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