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24AA64-E/P

Microchip Technology

24AA64-E/P by Microchip Technology

24AA64-E/P by Microchip Technology is an 8KX8 EEPROM with I2C control byte 1010DDDR. Operating at -40 to 125 °C, it offers 1000000 write/erase cycles and a max clock frequency of 0.4 MHz. Ideal for automotive applications due to AEC-Q100 screening level and hardwire write protection feature.

Median Price

$0.700

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 9,480 parts In-Stock

1+ parts

$0.700

100+ parts

$0.650

1k+ parts

$0.610

10k+ parts

$0.580

9,480

$0.700

$0.650

$0.610

$0.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

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10

$0.670

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VNN

France . 5,955 parts In-Stock

1+ parts

-

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5,955

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Vyrian

USA . 2,787 parts In-Stock

1+ parts

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2,787

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Prism Electronics

USA . 69 parts In-Stock

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69

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,921 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

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10k+ parts

-

13,921

$0.590

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

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2,000

$0.670

-

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$15.460

100+ parts

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607

$15.460

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QUARKTWIN TECHNOLOGY LTD

USA . 27,472 parts In-Stock

1+ parts

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27,472

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Lixinc

USA . 17,329 parts In-Stock

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17,329

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West Coast Incorporated

USA . 2,704 parts In-Stock

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2,704

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Overview

Unlock endless possibilities with the 24AA64-E/P EEPROM by Microchip Technology. With a reputation for quality and reliability, this memory IC is perfect for automotive applications, offering 8Kx8 organization and 1000000 write/erase cycles. Its I2C serial bus type and hardware write protection ensure data security, while its compact package shape and low power consumption make it ideal for space-constrained environments. Experience seamless performance and durability with the 24AA64-E/P, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the EEPROM, making it a reliable choice.

Screening Level:

AEC-Q100 - This level of screening ensures the EEPROM meets automotive quality standards, ideal for automotive applications.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy integration into electronic systems, maximizing space efficiency.

Operating Mode:

SYNCHRONOUS - The synchronous operation enhances data transfer speed and efficiency, making it suitable for high-performance applications.

Nominal Supply Voltage:

4.5V - The 4.5V supply voltage ensures stable and efficient operation of the EEPROM.

No. of Terminals:

8 - With 8 terminals, this EEPROM can easily interface with other components in a circuit.

Package Style:

IN-LINE - The in-line package style offers straightforward installation and mounting options.

Maximum Operating Temperature:

125 °C - The high operating temperature range allows for use in various environments without compromising performance.

Organization:

8KX8 - The 8KX8 organization provides ample memory capacity for storing data in a compact size.

Output Characteristics:

OPEN-DRAIN - The open-drain output characteristics offer flexibility in driving external circuitry, making it versatile for different applications.

Technical Specifications

EEPROM 24AA64-E/P attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.271 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

4.5

Screening Level:

AEC-Q100

Maximum Seated Height:

5.334 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA64-E/P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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