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24AA256T-E/SM

Microchip Technology

24AA256T-E/SM by Microchip Technology

24AA256T-E/SM by Microchip Technology is a 32Kx8 EEPROM with 262144-bit memory density. Operating at 2.5V, it offers 1000000 write/erase cycles and supports I2C serial bus type. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,110 parts In-Stock

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8,110

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VNN

France . 747 parts In-Stock

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747

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Nova Conductors

Japan . 84 parts In-Stock

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84

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Distributors (Availability)

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Corohmni

South Africa . 957 parts In-Stock

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$3.890

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957

$3.890

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Ampacity Inc.

Singapore . 585 parts In-Stock

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$5.000

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585

$5.000

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Microchip USA

USA . 3,139 parts In-Stock

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$7.262

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$7.262

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Component Stockers USA

USA . 5,750 parts In-Stock

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$12.760

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5,750

$12.760

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AZTECH Wire

Italy . 815 parts In-Stock

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$20.020

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815

$20.020

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QUARKTWIN TECHNOLOGY LTD

USA . 14,994 parts In-Stock

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Fulton Briggs Corp.

USA . 5,935 parts In-Stock

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Continental Prestige Electronics

USA . 4,454 parts In-Stock

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Argo Parts USA

USA . 764 parts In-Stock

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764

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of reliable data storage with the 24AA256T-E/SM by Microchip Technology. Crafted with precision and expertise, this EEPROM device offers unparalleled quality and performance for a wide range of applications in the automotive industry. With excellent endurance and fast write cycle times, customers can trust in the value and benefits that come with choosing this product. Experience peace of mind knowing your data is secure and easily accessible with the 24AA256T-E/SM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various environmental conditions.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Screening Level: AEC-Q100

Automotive Electronics Council (AEC) qualification ensures high reliability and performance in automotive applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and data transfer synchronization, enhancing overall system efficiency.

Nominal Supply Voltage / Vsup (V): 2.5

Efficient power consumption at a moderate voltage level for optimized performance.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages enables flexibility in system design and integration.

No. of Terminals: 8

Simplified connectivity with a manageable number of terminals for easy integration.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in harsh environments.

Organization: 32KX8

Organized memory structure for efficient data storage and retrieval.

Output Characteristics: OPEN-DRAIN

Open-drain output configuration enhances compatibility with various system architectures.

Minimum Operating Temperature: -40 °C

Extreme low-temperature tolerance for reliable operation in cold environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides corrosion resistance and solderability for long-lasting connections.

I2C Control Byte: 1010DDDR

I2C control byte format for efficient and standardized communication protocol.

Terminal Position: DUAL

Dual terminal position for enhanced stability and reliability in connectivity.

Write Protection: HARDWARE

Hardware-based write protection feature for data security and integrity.

Maximum Seated Height: 2.03 mm

Low-profile design for space-constrained applications and easy PCB integration.

Maximum Clock Frequency (fCLK): 0.4 MHz

High clock frequency support for fast data transfer rates and efficient system performance.

Width: 5.25 mm

Compact width dimensions for space-efficient PCB layout.

Minimum Supply Voltage (Vsup): 1.7 V

Low supply voltage support for energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient time allowance for peak reflow processes during assembly.

Peak Reflow Temperature °C: 260

High-temperature resistance for reliable reflow soldering processes.

Length: 5.26 mm

Compact length dimensions for space-efficient PCB layout.

Programming Voltage (V): 2.5

Efficient programming voltage level for reliable data programming and storage.

Temperature Grade: AUTOMOTIVE

Industry-standard automotive temperature grade for reliable performance in automotive applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Parallel or Serial: SERIAL

Serial data communication interface for simplified integration and operation.

Terminal Form: GULL WING

Gull-wing terminal form for easy soldering and robust mechanical connections.

Maximum Supply Current: 3 mA

Low supply current requirement for energy-efficient operation.

No. of Words: 32768 words

Large memory capacity for storing extensive data and information.

Memory Width: 8

8-bit memory width for efficient data processing and access.

Minimum Data Retention Time: 200

Long data retention time for reliable data storage and integrity.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and integration.

No. of Words Code: 32K

Code organization for easy identification of memory capacity.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 for enhanced reliability in humid environments.

Maximum Supply Voltage (Vsup): 5.5 V

High supply voltage support for versatile system integration and operation.

Endurance: 1000000 Write/Erase Cycles

High endurance rating for reliable and long-lasting data read/write operations.

Serial Bus Type: I2C

I2C serial bus type for standardized and efficient data communication.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time for quick data programming and access.

Memory Density: 262144 bit

High memory density for storing large amounts of data in a compact form factor.

Memory IC Type: EEPROM

EEPROM memory type for non-volatile data storage and retrieval.

Maximum Standby Current: 0.000005 Amp

Ultra-low standby current for minimal power consumption during idle periods.

Technical Specifications

EEPROM 24AA256T-E/SM attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA256T-E/SM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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