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24AA08T-I/MNY

Microchip Technology

24AA08T-I/MNY by Microchip Technology

24AA08T-I/MNY by Microchip Tech is an EEPROM with 1KX8 organization, 8192 bit memory density, and 1000000 write/erase cycles. It operates in industrial temperature grade, has I2C serial bus type, and offers hardware write protection. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.370

100+ parts

-

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600

$0.370

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VNN

France . 28,895 parts In-Stock

1+ parts

-

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28,895

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Vyrian

USA . 6,193 parts In-Stock

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6,193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,598 parts In-Stock

1+ parts

$0.348

100+ parts

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9,598

$0.348

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$4.348

100+ parts

$3.957

1k+ parts

$3.565

10k+ parts

-

100

$4.348

$3.957

$3.565

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Corohmni

South Africa . 715 parts In-Stock

1+ parts

$5.244

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715

$5.244

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AZTECH Wire

Italy . 1,128 parts In-Stock

1+ parts

$10.010

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1,128

$10.010

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iodParts Technologies Inc.

India . 194,990 parts In-Stock

1+ parts

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194,990

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Lixinc

USA . 16,134 parts In-Stock

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16,134

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Fulton Briggs Corp.

USA . 5,601 parts In-Stock

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5,601

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.363

1k+ parts

$0.352

10k+ parts

$0.344

100

-

$0.363

$0.352

$0.344

Overview

Unlock the power of reliable data storage with the 24AA08T-I/MNY EEPROM by Microchip Technology. Designed for industrial-grade performance, this small outline IC boasts a high endurance of 1,000,000 write/erase cycles and a wide operating temperature range. Perfect for applications requiring secure and long-lasting memory solutions, this EEPROM offers the perfect balance of quality, durability, and value. Upgrade your projects with the industry-leading technology of Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it is durable and resistant to heat and chemicals, ensuring the longevity and reliability of the EEPROM.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination of data transfers, enhancing the overall performance and efficiency of the EEPROM.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V ensures compatibility with various systems and devices, making this EEPROM versatile and widely applicable.

Maximum Operating Temperature: 85 °C

With a high operating temperature range of 85°C, this EEPROM can withstand harsh environmental conditions and is suitable for industrial applications.

Memory Density: 8192 bit

With a high memory density of 8192 bits, this EEPROM offers ample storage capacity for data, making it suitable for storing large amounts of information.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1 million write/erase cycles ensures the reliability and longevity of the data stored in the EEPROM, making it a durable and dependable choice.

Technical Specifications

EEPROM 24AA08T-I/MNY attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1.7V TO 2.5V @ 0.1MHz

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010XMMR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA08T-I/MNY Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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