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DS-112

M/a-com Technology Solutions

DS-112 by M/a-com Technology Solutions

DS-112 by M/a-com Tech: RF/Microwave Splitter with 30 dBm CW power, 1.5 VSWR, and 0.85 dB insertion loss. Ideal for applications requiring 10-500 MHz frequency range, such as signal splitting in communication systems. Operating temp from -55 to 85 °C ensures reliable performance in various environments.

Median Price

$13.800

Lifecycle Status

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10

In-Stock Inventory

1k+

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Bürklin Elektronik

Germany . 12 parts In-Stock

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$13.800

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Distrelec

Netherlands . 12 parts In-Stock

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$14.941

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Master Electronics

USA . 7 parts In-Stock

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$12.450

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$12.450

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Rapid Electronics

USA . 6 parts In-Stock

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$9.286

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Nova Conductors

Japan . 1,000 parts In-Stock

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$12.637

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Electronic Expediters

USA . 411 parts In-Stock

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Vyrian

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Electro Mavin

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Prism Electronics

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Resion

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AZTECH Wire

Italy . 677 parts In-Stock

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$12.609

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Continental Prestige Electronics

USA . 2,237 parts In-Stock

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$12.637

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$12.384

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Netroflash

USA . 500 parts In-Stock

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$12.637

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$12.637

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Argo Parts USA

USA . 4,680 parts In-Stock

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Overview

Experience seamless connectivity with the DS-112 by M/a-com Technology Solutions, a leading provider of RF/Microwave Splitter/Combiners. This versatile device offers unparalleled performance and reliability, with a maximum input power of 30 dBm and a maximum voltage standing wave ratio of 1.5. Whether you're in the telecommunications, aerospace, or defense industries, this splitter is designed to meet your needs with its wide operating frequency range of 10 MHz to 500 MHz. Trust M/a-com Technology Solutions to deliver quality products that exceed expectations and enhance your systems' capabilities. Upgrade to the DS-112 and unlock a world of possibilities for your applications today.

Feature Benefit Bullets

Maximum Input Power (CW) 30 dBm:

With a high maximum input power, this splitter/combiner can handle strong signals without distortion.

Maximum Voltage Standing Wave Ratio 1.5:

The low VSWR ensures efficient power transfer and minimal signal loss.

Maximum Operating Temperature 85 °C:

Able to operate in high temperature environments, offering reliability in various conditions.

Minimum Operating Temperature -55 °C:

Can function in extremely low temperatures, making it suitable for outdoor or harsh environments.

Maximum Insertion Loss 0.85 dB:

Provides minimal signal attenuation, ensuring efficient signal distribution.

RF or Microwave Device Type SPLITTER:

Specifically designed for splitting or combining RF/microwave signals, ensuring optimal performance.

Characteristic Impedance 50 ohm:

Matches the impedance of common RF systems, ensuring seamless integration.

Minimum Operating Frequency 10 MHz:

Capable of handling low frequency signals, making it versatile for different applications.

Maximum Operating Frequency 500 MHz:

Can accommodate high frequency signals, making it suitable for a wide range of RF/microwave devices.

Technical Specifications

RF/Microwave Splitter/Combiners DS-112 attributes and parameters. Explore more RF/Microwave Splitter/Combiners devices from M/a-com Technology Solutions

Specs

Characteristic Impedance:

50 ohm

Maximum Input Power (CW):

30 dBm

Maximum Insertion Loss:

.85 dB

Maximum Operating Frequency:

500 MHz

Minimum Operating Frequency:

10 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

RF or Microwave Device Type:

Maximum Voltage Standing Wave Ratio:

1.5

Manufacturer Highlights

M/a-com Technology Solutions

MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. MACOM has achieved certification to the IATF16949 automotive standard, the ISO9001 international quality standard and the ISO14001 environmental management standard. MACOM has more than 70 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operates facilities throughout the United States, Europe, and Asia.

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