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LCMXO2-7000ZE-1BG256I

Lattice Semiconductor

LCMXO2-7000ZE-1BG256I by Lattice Semiconductor

LCMXO2-7000ZE-1BG256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 6864 logic cells. It operates at a max supply voltage of 1.26V and has 206 inputs and outputs. This FPGA is commonly used in applications requiring programmable ICs for various electronic systems.

Median Price

$23.838

Lifecycle Status

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5

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1k+

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Flip Electronics (Authorized)

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 686 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Microchip USA

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Semicontronic

India . 146 parts In-Stock

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Corohmni

South Africa . 106 parts In-Stock

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Ampacity Inc.

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Aztec Data Supply Inc.

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Overview

Discover the power and versatility of the LCMXO2-7000ZE-1BG256I by Lattice Semiconductor. As a leading manufacturer in the field, Lattice Semiconductor delivers top-notch quality and reliability. This Field Programmable Gate Array (FPGA) offers endless possibilities with its 6864 logic cells and 206 inputs and outputs. Its compact size and surface mount capability make it perfect for a wide range of applications. Whether you're designing cutting-edge electronics or exploring new possibilities in automation, this FPGA provides the value, benefits, and advantages you need. Embrace innovation and unlock your full potential with the LCMXO2-7000ZE-1BG256I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the FPGA, ensuring durability and reliability in various environments.

No. of Logic Cells: 6864

Offers a high level of programmable logic for complex applications, allowing for versatile and customizable designs.

Surface Mount: YES

Facilitates easy and efficient mounting on circuit boards, saving time and labor during assembly.

Maximum Supply Voltage: 1.26 V

Allows for efficient power management and operation within safe voltage limits.

No. of Inputs: 206

Provides ample input channels for connecting to external devices and sensors, enhancing the functionality of the FPGA.

Package Shape: SQUARE

Optimizes space utilization on the circuit board, ensuring efficient layout and design considerations.

Form Of Terminal: BALL

Enables reliable and secure connections with other components, reducing the risk of signal interference or disconnection.

Nominal Supply Voltage (V): 1.2

Maintains stable power supply for consistent performance and operation of the FPGA.

Packing Method: TRAY

Facilitates convenient storage, handling, and transportation of the FPGAs, ensuring protection during shipping and distribution.

Power Supplies (V): 1.2

Matches the nominal supply voltage for optimal performance and compatibility with other components in the system.

No. of Terminals: 256

Provides sufficient connection points for interfacing with external circuits, devices, and networks.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility for customizing and reprogramming the logic functions, making it versatile for different applications and requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the physical layout and assembly of the FPGA on the circuit board, optimizing space efficiency and signal integrity.

Minimum Supply Voltage: 1.14 V

Provides a lower limit for safe voltage operation, ensuring reliable performance and protection against overvoltage conditions.

Maximum Operating Temperature: 100 °C

Supports reliable operation in a wide range of environmental conditions, making it suitable for industrial and commercial applications.

Pitch Of Terminal: 0.8 mm

Allows for compact and dense packaging of the terminals, optimizing the layout and interconnection of the FPGA on the circuit board.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold conditions, making it suitable for outdoor or rugged environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Provides a reliable and durable finish for the terminal connections, ensuring long-term stability and connectivity.

Position Of Terminal: BOTTOM

Facilitates easy access and connection with other components on the circuit board, enhancing the overall reliability and performance of the FPGA.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability and performance in humid or wet conditions.

Maximum Seated Height: 1.7 mm

Maintains a low profile for space-constrained applications, ensuring compatibility with compact electronic devices.

Width: 14 mm

Provides a compact form factor for easy integration and placement on the circuit board, optimizing space efficiency.

No. of Outputs: 206

Facilitates communication with external devices and systems, enhancing the functionality and versatility of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures efficient and reliable soldering during assembly, saving time and labor in the manufacturing process.

Peak Reflow Temperature °C: 260

Allows for high-temperature reflow soldering, ensuring strong and durable connections between the FPGA and the circuit board.

Length: 14 mm

Matches the width dimension for a compact and square form factor, optimizing the layout and assembly of the FPGA on the circuit board.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-7000ZE-1BG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

6864

No. of Inputs:

206

No. of Outputs:

206

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2-7000ZE-1BG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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