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ISPPAC-POWR607-01S32I

Lattice Semiconductor

ISPPAC-POWR607-01S32I by Lattice Semiconductor

ISPPAC-POWR607-01S32I by Lattice Semiconductor is a Power Management IC with 3/3.6V power supplies, 32 terminals, and 6 channels. It features a square surface mount package style suitable for industrial applications requiring a min operating temperature of -40°C and max of 85°C. The IC supports power supply circuits with adjustable threshold and CMOS technology.

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Overview

Elevate your power management game with the ISPPAC-POWR607-01S32I by Lattice Semiconductor. Designed with precision and reliability in mind, this Power Management IC delivers seamless performance for a wide range of applications. With its compact square package shape and advanced technology, this product offers unmatched efficiency and control. Whether you're in need of power supply support circuit or voltage regulation, this IC is the ultimate solution. Trust Lattice Semiconductor to bring you quality products that exceed expectations. Upgrade your power management system today and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape provides a compact and uniform design, making it easier to integrate into various electronic devices.

Power Supplies (V): 3/3.6

Support for a range of power supplies allows for flexibility in usage, accommodating different voltage requirements.

No. of Terminals: 32

Having a higher number of terminals allows for more connectivity options, enabling the IC to support a wider range of functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient thermal management and space-saving benefits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for industrial applications where heat tolerance is crucial.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position provides good stability and connectivity in the circuit layout, ensuring reliable operation.

Maximum Seated Height: 1 mm

The low maximum seated height enables the IC to be used in compact devices where space is limited.

Width (mm): 5 mm

The small width of 5mm allows for easy integration into electronic designs with tight spatial constraints.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC is specifically designed to optimize and stabilize power delivery, ensuring the reliability of the overall system.

Minimum Supply Voltage (Vsup): 2.64 V

The low minimum supply voltage requirement allows for efficient power usage and compatibility with a variety of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and consistent soldering during the manufacturing process.

Peak Reflow Temperature °C: 240

The high peak reflow temperature tolerance indicates the IC's robustness and reliability in harsh environmental conditions.

Length: 5 mm

The compact length of 5mm allows for easy integration into electronic designs with space constraints.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions, this IC is suitable for demanding applications in harsh environments.

Maximum Supply Current (Isup): 5 mA

With a maximum supply current of 5mA, this IC ensures efficient power consumption and minimal heat generation.

No. of Channels: 6

Having 6 channels allows for multiple power supply configurations and monitoring capabilities, enhancing system flexibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in various applications.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of soldering defects, ensuring consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and efficient connectivity, making the IC suitable for compact designs.

Maximum Supply Voltage (Vsup): 3.96 V

With a high maximum supply voltage, this IC can handle a wide range of input voltages, providing versatility and compatibility.

Adjustable Threshold: YES

The adjustable threshold feature allows for customizing the IC's operation to specific requirements, enhancing flexibility and performance optimization.

Technical Specifications

Power Management ICs ISPPAC-POWR607-01S32I attributes and parameters. Explore more Power Management ICs devices from Lattice Semiconductor

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

3.96 V

Minimum Supply Voltage (Vsup):

2.64 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

ISPPAC-POWR607-01S32I Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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