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ISPPAC-POWR6AT6-01NN32I

Lattice Semiconductor

ISPPAC-POWR6AT6-01NN32I by Lattice Semiconductor

ISPPAC-POWR6AT6-01NN32I by Lattice Semiconductor is a Power Management IC with 3/3.3V power supplies, 32 terminals, and 6 channels. It features a square surface mount package style suitable for industrial applications requiring a min operating temperature of -40°C and max of 85°C. This IC supports power supply circuits with adjustable threshold and operates on CMOS technology.

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Ampacity Inc.

Singapore . 429 parts In-Stock

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Microchip USA

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Overview

Experience unparalleled power management with the ISPPAC-POWR6AT6-01NN32I by Lattice Semiconductor. This cutting-edge Power Management IC offers exceptional quality and reliability, backed by the reputable manufacturer, Lattice Semiconductor. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Say goodbye to power supply issues and hello to seamless performance with this innovative solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape provides a compact footprint, making it suitable for designs with limited space constraints.

Power Supplies (V): 3/3.3

Support for multiple power supply voltages allows for flexibility in compatibility with various systems and devices.

No. of Terminals: 32

With a large number of terminals, this IC offers a high level of connectivity for complex power management tasks.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers a versatile solution for thermal management and space-saving requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables this IC to function in extreme cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and reliable electrical connections.

Terminal Position: QUAD

Quad terminal position facilitates easy integration into quad flat packages, enhancing compatibility with other components.

Maximum Seated Height: 1 mm

Low maximum seated height allows for a low-profile design, suitable for compact devices or applications with height constraints.

Width (mm): 5 mm

Narrow width of 5mm contributes to space-saving and efficient PCB layout designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed as a power supply support circuit, offering reliable and efficient power management capabilities.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage requirement allows for operation in low-power applications or with limited power sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering process and reliability during assembly.

Length: 5 mm

Compact length of 5mm contributes to a small overall footprint and efficient use of board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with extreme temperature variations.

Maximum Supply Current (Isup): 10 mA

Low maximum supply current requirement indicates energy-efficient operation and minimal power consumption.

No. of Channels: 6

With 6 channels, this IC can handle multiple power management tasks simultaneously, improving overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance in power management applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and offers environmental benefits.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and compact design integration.

Maximum Supply Voltage (Vsup): 3.96 V

High maximum supply voltage capability allows for compatibility with a wide range of power sources and voltage levels.

Adjustable Threshold: YES

Presence of adjustable threshold feature provides flexibility in setting voltage thresholds for customized power management requirements.

Technical Specifications

Power Management ICs ISPPAC-POWR6AT6-01NN32I attributes and parameters. Explore more Power Management ICs devices from Lattice Semiconductor

Specs

Additional Features:

IN-SYSTEM PROGRAMMABLE THROUGH JTAG

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

3.96 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

ISPPAC-POWR6AT6-01NN32I Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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